Ornamental design for a circuit pack faceplate

- AT&T
Description

FIG. 1 is a front view of a circuit pack faceplate in accordance with the embodiment of the design;

FIG. 2 is a side view thereof;

FIG. 3 is a view of the side opposite to that shown in FIG. 2;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is a front view of a circuit pack faceplate in accordance with the second embodiment of the design; and,

FIG. 9 is a side view thereof, all other views are the same as the first embodiment except for the presence of the two ribs at the top of the front.

The broken line showing throughout the drawing figures is included for the purpose of illustrating environmental elements only and forms no part of the claimed design.

Referenced Cited
U.S. Patent Documents
D236733 September 1975 Clement et al.
D302543 August 1, 1989 Mayo et al.
D302544 August 1, 1989 Spira
D303657 September 26, 1989 Mayo et al.
Patent History
Patent number: D346154
Type: Grant
Filed: Dec 16, 1991
Date of Patent: Apr 19, 1994
Assignee: AT&T Bell Laboratories (Murray Hill, NJ)
Inventors: Tor A. Alden (Bernardsville, NJ), Gihyun Cho (Franklin Lakes, NJ), Fredrick G. Randall (Newark, NJ)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Attorney: Lester H. Birnbaum
Application Number: 7/807,383
Classifications