Integrated circuit electronic package

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Description

FIG. 1 is a left, front perspective view showing my new integrated circuit electronic package design as it is attached to an integrated circuit;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side elevational view thereof which is a mirror image of the left side elevational view.

Referenced Cited
U.S. Patent Documents
D271197 November 1, 1983 Jones et al.
4356532 October 26, 1982 Donaher et al.
4637670 January 20, 1987 Coller et al.
4826440 May 2, 1989 Plocek et al.
4936784 June 26, 1990 Saito
5208529 May 4, 1993 Tsurishima et al.
Foreign Patent Documents
164949 December 1985 EPX
57-155744 September 1982 JPX
Other references
  • Data sheet for "Ansley 28-Position Low-Profile Prom Socket and Header Module", Thomas & Betts Corp., catalog, 1988, 6 pages. Data sheet for "Ansley Dip Sockets with Decoupling Capacitor", Thomas & Betts Corp. catalog, 1988, 2 pages.
Patent History
Patent number: D355411
Type: Grant
Filed: Jun 4, 1993
Date of Patent: Feb 14, 1995
Assignee: Cicon Components, Inc. (Chatsworth, CA)
Inventor: Amir-Akbar Sadigh-Behzadi (Van Nuys, CA)
Primary Examiner: Joel Sincavage
Law Firm: Knobbe, Martens, Olson & Bear
Application Number: 0/9,137