Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Heat insulator cover of semiconductor manufacturing apparatus
    Patent number: D1003834
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: November 7, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Circuit board
    Patent number: D1003842
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: November 7, 2023
    Assignee: The Noco Company
    Inventors: James P. McBride, Matthew Michael Bosway
  • Data processing chip
    Patent number: D1003889
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: November 7, 2023
    Assignee: HANGZHOU CHIPJET TECHNOLOGY CO., LTD.
    Inventors: Xiaogai Peng, Xiaojing Ma
  • Electrode cover for a plasma processing apparatus
    Patent number: D1005245
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: November 21, 2023
    Assignee: Hitachi High-Tech Corporation
    Inventors: Shintarou Nakatani, Takamasa Ichino, Kazunori Nakamoto, Yuki Tanaka
  • Gas distributor for semiconductor manufacturing apparatus
    Patent number: D1005974
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: November 28, 2023
    Assignee: ASM IP Holding B.V.
    Inventors: JinHo Shin, JaeHyun Kim, JeongHo Lee
  • Semiconductor wafer for mosaic solar cell fabrication
    Patent number: D1006768
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: December 5, 2023
    Assignee: SolAero Technologies Corp.
    Inventors: Daniel Aiken, Daniel Derkacs, Claiborne McPheeters
  • Target profile for a physical vapor deposition chamber target
    Patent number: D1007449
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: December 12, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: David Gunther, Kirankumar Neelasandra Savandaiah, Jiao Song, Madan Kumar Shimoga Mylarappa, Yue Cui, Nuno Yen-Chu Chen, Mengxue Wu
  • Ion shield plate for plasma processing apparatus
    Patent number: D1008986
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: December 26, 2023
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yusuke Nakatani, Kazuumi Tanaka, Masahiro Yamaoka, Yasushi Sonoda, Taku Iwase
  • LED chip
    Patent number: D1009814
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: January 2, 2024
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Senpeng Huang, Qiuxia Lin, Jian Liu
  • Circuit board
    Patent number: D1009815
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: January 2, 2024
    Assignee: The Noco Company
    Inventors: James P McBride, Matthew Michael Bosway
  • Collimator for a physical vapor deposition chamber
    Patent number: D1009816
    Type: Grant
    Filed: August 29, 2021
    Date of Patent: January 2, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Keith A. Miller, Fuhong Zhang, Luke Vianney Varkey, Kishor Kumar Kalathiparambil, Xiangjin Xie
  • Shadow ring lift pin
    Patent number: D1009817
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: January 2, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Zubin Huang, Srinivas Tokur Mohana, Shreyas Patil Shanthaveeraswamy, Sandesh Yadamane, Jallepally Ravi, Harpreet Singh, Manjunatha Koppa
  • Semiconductor device
    Patent number: D1009818
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: January 2, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Tsunehisa Ono
  • Semiconductor device
    Patent number: D1009819
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: January 2, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Tsunehisa Ono
  • Circuit board
    Patent number: D1010591
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: January 9, 2024
    Assignee: The Noco Company
    Inventors: James P. McBride, Matthew Michael Bosway
  • Semiconductor module
    Patent number: D1012048
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: January 23, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Yoshihisa Tsukamoto, Akihiro Kimura, Masaaki Matsuo
  • Semiconductor module
    Patent number: D1012049
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: January 23, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Computer
    Patent number: D1012050
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: January 23, 2024
    Assignee: RASPBERRY PI (TRADING) LIMITED
    Inventor: James Adams
  • Circuit board sensor pad
    Patent number: D1012871
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: January 30, 2024
    Assignee: Roche Molecular Systems, Inc.
    Inventor: Uichong Brandon Yi
  • Circuit board
    Patent number: D1012872
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: January 30, 2024
    Assignee: The Noco Company
    Inventors: James P McBride, Matthew Michael Bosway
  • Semiconductor module
    Patent number: D1013647
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: February 6, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Semiconductor module
    Patent number: D1013648
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: February 6, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Discharge device
    Patent number: D1014444
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 13, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yohei Ishigami, Makoto Imai, Hidetoshi Hata, Takafumi Omori, Tetsunori Aono, Kenji Ogura, Yuki Takigawa
  • Discharge device
    Patent number: D1014445
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 13, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yohei Ishigami, Makoto Imai, Hidetoshi Hata, Takafumi Omori, Tetsunori Aono, Kenji Ogura, Yuki Takigawa
  • Semiconductor module
    Patent number: D1015283
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: February 20, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Semiconductor module
    Patent number: D1015284
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: February 20, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Top plate for semiconductor manufacturaing equipment
    Patent number: D1016761
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: March 5, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Takuto Umetsu, Masayoshi Yajima, Kunihiko Suzuki
  • Flexible printed circuit board
    Patent number: D1016762
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: March 5, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Toshio Horiki, Yoshihiko Ishida
  • Nozzle holder of substrate processing apparatus
    Patent number: D1017561
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: March 12, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Hironori Shimada
  • Inner tube of reaction tube for semiconductor manufacturing equipment
    Patent number: D1019581
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 26, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Atsushi Hirano
  • Inner tube of reaction tube for semiconductor manufacturing equipment
    Patent number: D1019582
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 26, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Atsushi Hirano
  • Inner tube of reaction tube for semiconductor manufacturing equipment
    Patent number: D1019583
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 26, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Atsushi Hirano
  • Semiconductor module
    Patent number: D1021829
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Yoshihisa Tsukamoto, Akihiro Kimura
  • Semiconductor module
    Patent number: D1021830
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Power semiconductor module
    Patent number: D1021831
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: April 9, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Kenji Yamamoto, Yasunori Kutsuma
  • Elastic membrane
    Patent number: D1021832
    Type: Grant
    Filed: April 19, 2023
    Date of Patent: April 9, 2024
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Akazawa, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Tomoko Owada, Cheng Cheng, Yuichi Kato
  • Tubular reactor
    Patent number: D1022904
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Tubular reactor
    Patent number: D1022905
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Tubular reactor
    Patent number: D1022906
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Tubular reactor
    Patent number: D1022907
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • LED chip
    Patent number: D1022930
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: April 16, 2024
    Assignee: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Senpeng Huang, Qiuxia Lin, Jian Liu
  • Integrated circuit
    Patent number: D1022931
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Vignesh Kannan, Joshua M. Yu, Matthew David Smith, Jeffrey A. Nielsen, Kenneth Duda
  • Semiconductor module
    Patent number: D1022932
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 16, 2024
    Assignee: ROHM CO., LTD.
    Inventor: Yoshihisa Tsukamoto
  • Wafer support of semiconductor manufacturing apparatus
    Patent number: D1022933
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: April 16, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Gripper for wafer cassette
    Patent number: D1023984
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: April 23, 2024
    Assignee: OMRON CORPORATION
    Inventors: Tomohiro Okada, Takahiro Inoue
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1024149
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: April 23, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Luke Vianney Varkey, Xiangjin Xie
  • Printed circuit board for mouth guard
    Patent number: D1024986
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: April 30, 2024
    Assignee: IP Moat, Inc.
    Inventors: John Gabriel, Sarnab Bhattacharya
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1025935
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: May 7, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Luke Vianney Varkey, Xiangjin Xie
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1025936
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: May 7, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Luke Vianney Varkey, Xiangjin Xie
  • Collimator for a physical vapor deposition (PVD) chamber
    Patent number: D1026054
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: May 7, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Keith A. Miller, Luke Vianney Varkey, Xiangjin Xie, Kishor Kumar Kalathiparambil