Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Semiconductor device
    Patent number: D1046800
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: October 15, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Shogo Shibata
  • Semiconductor device
    Patent number: D1046801
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: October 15, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shuhei Yokoyama, Shogo Shibata
  • Susceptor cover
    Patent number: D1047884
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: October 22, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Yoshiaki Daigo, Takuto Umetsu
  • Semiconductor package
    Patent number: D1049065
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: October 29, 2024
    Assignee: JMJ KOREA CO., LTD.
    Inventor: Yun Hwa Choi
  • Base for a multi-chamber semiconductor
    Patent number: D1049066
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: October 29, 2024
    Assignee: SYSKEY TECHNOLOGY CO., LTD.
    Inventors: Hsueh-Hsien Wu, Chih-Yuan Chan, Yi-Ting Lai
  • Ring for an anti-rotation process kit for a substrate processing chamber
    Patent number: D1049067
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: October 29, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rohan Vijay Rane, Xue Yang Chang, Timothy Joseph Franklin, Daniel Sang Byun
  • Circuit board for computer printers
    Patent number: D1050059
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: November 5, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Shuichi Nakano, Jun Sato, Yasuhiko Kosugi
  • Exhaust wall liner for semiconductor manufacturing apparatus
    Patent number: D1051081
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: November 12, 2024
    Assignee: AP SYSTEMS INC.
    Inventors: Chang Min Kwon, Chang Kyo Kim
  • Circuit board
    Patent number: D1051082
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: November 12, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Kenichi Nakazato, Takeshi Hosokawa
  • Single-slot tubular cathode
    Patent number: D1051838
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: November 19, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Bon-Woong Koo, Frank Sinclair, Alexandre Likhanskii, Svetlana Radovanov, Alexander Perel, Graham Wright, Jay T. Scheuer, Daniel Tieger, You Chia Li, Jay Johnson, Tseh-Jen Hsieh, Ronald Johnson
  • Semiconductor probe pin
    Patent number: D1051865
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: November 19, 2024
    Assignee: POINT ENGINEERING CO., LTD.
    Inventor: Bum Mo Ahn
  • Circuit board
    Patent number: D1051866
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: November 19, 2024
    Assignee: FLEECE PERFORMANCE ENGINEERING, INC.
    Inventors: Brayden Fleece, Jeffrey W. Everett, Matthew Miller
  • Confinement liner for a substrate processing chamber
    Patent number: D1051867
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: November 19, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Joseph Perry
  • Circuit board
    Patent number: D1052544
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: November 26, 2024
    Assignee: FLEECE PERFORMANCE ENGINEERING, INC.
    Inventors: Brayden Fleece, Jeffrey W. Everett, Matthew Miller
  • Semiconductor device
    Patent number: D1052545
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: November 26, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Aiko Miyazaki, Takahiro Arakawa, Tomoyuki Kawakami, Satoshi Kobayashi
  • Cover ring of top plate for semiconductor manufacturing apparatus
    Patent number: D1052546
    Type: Grant
    Filed: February 15, 2023
    Date of Patent: November 26, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Takuto Umetsu, Masayoshi Yajima, Kunihiko Suzuki
  • Semiconductor wafer and susceptor heating
    Patent number: D1052547
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: November 26, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Kunihiko Suzuki, Takuto Umetsu
  • Gas diffuser
    Patent number: D1052548
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: November 26, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Devi Raghavee Veerappan, Xiaoxiong Yuan, Peiyu Zhang, Borui Xia, Chih-Hsun Hsu
  • Furnace for substrate processing apparatus
    Patent number: D1053156
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: December 3, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hideto Tateno, Takatomo Yamaguchi, Daiki Kimoto
  • Heat reflector for semiconductor manufacturing equipment
    Patent number: D1053157
    Type: Grant
    Filed: January 24, 2023
    Date of Patent: December 3, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Akihiro Sato
  • Sputter target for a physical vapor deposition chamber
    Patent number: D1053230
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: December 3, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Siew Kit Hoi, Jay Min Soh, Mengxue Wu, Palaniappan Chidambaram
  • Wafer support of semiconductor manufacturing apparatus
    Patent number: D1053830
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: December 10, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Daiki Taniguchi
  • Carrier substrate for handling
    Patent number: D1054388
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: December 17, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
  • Semiconductor device
    Patent number: D1054389
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: December 17, 2024
    Assignee: NEC Corporation
    Inventors: Tomohiro Yamaji, Kohei Matsuura
  • Semiconductor device
    Patent number: D1054390
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: December 17, 2024
    Assignee: NEC Corporation
    Inventors: Tomohiro Yamaji, Kohei Matsuura
  • Circuit board
    Patent number: D1054391
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: December 17, 2024
    Assignee: SHENZHEN FANTTIK TECHNOLOGY
    Inventor: Bo Du
  • Cellular module
    Patent number: D1054404
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: December 17, 2024
    Assignee: KONTRON EUROPE GMBH
    Inventor: Annette Horn
  • Support ring for an interlocking process kit for a substrate processing chamber
    Patent number: D1055006
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: December 24, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Sahiti Nallagonda, Jonathan Simmons, Xinwei Huang, Peter Muraoka, Andreas Schmid
  • Laptop motherboard
    Patent number: D1055007
    Type: Grant
    Filed: January 31, 2024
    Date of Patent: December 24, 2024
    Inventor: Haoyang Liu
  • Circuit board
    Patent number: D1055879
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: December 31, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Kenichi Nakazato
  • Power module
    Patent number: D1055880
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: December 31, 2024
    Assignee: Delta Electronics, Inc.
    Inventors: Jen-Hsien Wong, Han-Lin Wu, Chun-Liang Chiang, Tai-Kuang Lee
  • Power semiconductor module
    Patent number: D1056861
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: January 7, 2025
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Kenji Yamamoto, Yasunori Kutsuma
  • Semiconductor package
    Patent number: D1056862
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: January 7, 2025
    Assignee: Wolfspeed, Inc.
    Inventors: Geza Dezsi, Devarajan Balaraman, Brice McPherson
  • Circuit board
    Patent number: D1056863
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: January 7, 2025
    Assignee: The Noco Company
    Inventors: James P. McBride, Matthew Michael Bosway, V
  • Pedestal for a substrate processing system
    Patent number: D1057675
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: January 14, 2025
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Gary B. Lind, Andrew Paul Eib
  • Reaction chamber base plate
    Patent number: D1059311
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: January 28, 2025
    Assignee: ASM IP Holding B.V.
    Inventors: Todd Dunn, Abhishek Mangoli, Ruchik Bhatt
  • Deposition ring of a process kit for semiconductor substrate processing
    Patent number: D1059312
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: January 28, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Abhishek Chowdhury, Nataraj Bhaskar Rao, Edwin C. Suarez, Harisha Sathyanarayana, Diego Ramiro Puente Sotomayor, Qanit Takmeel, Mohammad Kamruzzaman Chowdhury, Arun Chakravarthy Chakravarthy
  • Circuit board
    Patent number: D1059313
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: January 28, 2025
    Assignee: Canaan Creative Co., LTD.
    Inventors: Hongbin Mao, Nangeng Zhang
  • Circuit board with heat sink
    Patent number: D1059314
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: January 28, 2025
    Assignee: Canaan Creative Co., LTD.
    Inventors: Shaohua Zhang, Huan Yang, Nangeng Zhang
  • Package structure for a semiconductor element
    Patent number: D1059315
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: January 28, 2025
    Assignee: GaNrich Semiconductor Corporation
    Inventors: Jia-Tay Kuo, Chen-Yu Wang, Sheng-Bo Wang, Chiao Fu, Yao-Zhong Liu
  • Utility meter dual transceiver boards
    Patent number: D1060279
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: February 4, 2025
    Inventors: Michael Lee Gregory, Jason Edward Pintok, Ian Harvey
  • Light-emitting device
    Patent number: D1062026
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: February 11, 2025
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Yao-Ning Chan, Yi-Tang Lai, Yun-Chung Chou, Shih-Chang Lee, Chen Ou
  • CMP (chemical mechanical planarization) retaining ring
    Patent number: D1062662
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: February 18, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyungjoo Lee, Hyeondong Song
  • CMP (chemical mechanical planarization) retaining ring
    Patent number: D1063595
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: February 25, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyungjoo Lee, Hyeondong Song
  • Substrate lifter for semiconductor manufacturing equipment
    Patent number: D1063875
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: February 25, 2025
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tatsuki Jinden, Shinya Morita
  • Grounding ring of a process kit for semiconductor substrate processing
    Patent number: D1064005
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: February 25, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Abhishek Chowdhury, Nataraj Bhaskar Rao, Edwin C. Suarez, Harisha Sathyanarayana, Diego Ramiro Puente Sotomayor, Qanit Takmeel, Mohammad Kamruzzaman Chowdhury, Arun Chakravarthy Chakravarthy
  • Baffle for anti-rotation process kit for substrate processing chamber
    Patent number: D1066275
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: March 11, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rohan Vijay Rane, Xue Yang Chang, Timothy Joseph Franklin, Daniel Sang Byun
  • Process chamber pumping liner
    Patent number: D1066440
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: March 11, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Yang Li, Xi Cen, Kai Wu, Min-Han Lee, Mehran Behdjat
  • Susceptor
    Patent number: D1067204
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 18, 2025
    Assignee: ASM IP Holding B.V.
    Inventors: Shujin Huang, Junwei Su, Wentao Wang, Xing Lin
  • Circuit board
    Patent number: D1067206
    Type: Grant
    Filed: November 30, 2023
    Date of Patent: March 18, 2025
    Assignee: The Noco Company
    Inventors: James P. McBride, Matthew Michael Bosway