Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Mortarboard with electronic tube display
    Patent number: D1039243
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: August 20, 2024
    Inventor: Mahdi Al-Husseini
  • Deposition ring for physical vapor deposition chamber
    Patent number: D1040304
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: August 27, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: David Gunther, Cheng-Hsiung Tsai, Kirankumar Neelasandra Savandaiah
  • Tubular reactor
    Patent number: D1042340
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: September 17, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Yusaku Okajima
  • Sliding ring for an interlocking process kit for a substrate processing chamber
    Patent number: D1042373
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: September 17, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sahiti Nallagonda, Jonathan Simmons, Xinwei Huang, Peter Muraoka, Andreas Schmid
  • Support pipe for an interlocking process kit for a substrate processing chamber
    Patent number: D1042374
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: September 17, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sahiti Nallagonda, Jonathan Simmons, Xinwei Huang, Peter Muraoka, Andreas Schmid
  • Power semiconductor module
    Patent number: D1042375
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: September 17, 2024
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
    Inventors: Zhiqiang Niu, Bum-Seok Suh, Jong-Mu Lee, Jia-long Yuan, Junho Lee, Xiaorong Ge
  • Semiconductor module
    Patent number: D1042376
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: September 17, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Koshun Saito, Koki Nakano
  • Semiconductor device
    Patent number: D1043594
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: September 24, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Aiko Miyazaki, Takahiro Arakawa, Tomoyuki Kawakami, Satoshi Kobayashi
  • Semiconductor device
    Patent number: D1043595
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: September 24, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Aiko Miyazaki, Takahiro Arakawa, Tomoyuki Kawakami, Satoshi Kobayashi
  • Compliant ground block and testing system for testing integrated circuits
    Patent number: D1044751
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: October 1, 2024
    Assignee: Johnstech International Corporation
    Inventors: Valts Treibergs, Pat Joyal, Leslie Fliegelman
  • Flexible printed circuit board for game controllers
    Patent number: D1044752
    Type: Grant
    Filed: April 8, 2023
    Date of Patent: October 1, 2024
    Inventor: Jiarui Zhu
  • Flexible printed circuit board for game controllers
    Patent number: D1044753
    Type: Grant
    Filed: April 8, 2023
    Date of Patent: October 1, 2024
    Inventor: Jiarui Zhu
  • Lamp wick
    Patent number: D1046206
    Type: Grant
    Filed: April 30, 2024
    Date of Patent: October 8, 2024
    Inventor: Xianming Li
  • Lamp wick
    Patent number: D1046267
    Type: Grant
    Filed: April 29, 2024
    Date of Patent: October 8, 2024
    Inventor: Xianming Li
  • Gripper for semiconductor wafer housing cassette
    Patent number: D1046798
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: October 15, 2024
    Assignee: OMRON CORPORATION
    Inventors: Tomohiro Okada, Takahiro Inoue, Takeshi Maehiro
  • Semiconductor module
    Patent number: D1046799
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: October 15, 2024
    Assignee: ASAHI KASEI MICRODEVICES CORPORATION
    Inventors: Osamu Shirata, Yusuke Hidaka
  • Semiconductor device
    Patent number: D1046800
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: October 15, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Shogo Shibata
  • Semiconductor device
    Patent number: D1046801
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: October 15, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shuhei Yokoyama, Shogo Shibata
  • Susceptor cover
    Patent number: D1047884
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: October 22, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Yoshiaki Daigo, Takuto Umetsu
  • Semiconductor package
    Patent number: D1049065
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: October 29, 2024
    Assignee: JMJ KOREA CO., LTD.
    Inventor: Yun Hwa Choi
  • Base for a multi-chamber semiconductor
    Patent number: D1049066
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: October 29, 2024
    Assignee: SYSKEY TECHNOLOGY CO., LTD.
    Inventors: Hsueh-Hsien Wu, Chih-Yuan Chan, Yi-Ting Lai
  • Ring for an anti-rotation process kit for a substrate processing chamber
    Patent number: D1049067
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: October 29, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rohan Vijay Rane, Xue Yang Chang, Timothy Joseph Franklin, Daniel Sang Byun
  • Circuit board for computer printers
    Patent number: D1050059
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: November 5, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Shuichi Nakano, Jun Sato, Yasuhiko Kosugi
  • Exhaust wall liner for semiconductor manufacturing apparatus
    Patent number: D1051081
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: November 12, 2024
    Assignee: AP SYSTEMS INC.
    Inventors: Chang Min Kwon, Chang Kyo Kim
  • Circuit board
    Patent number: D1051082
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: November 12, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Kenichi Nakazato, Takeshi Hosokawa
  • Single-slot tubular cathode
    Patent number: D1051838
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: November 19, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Bon-Woong Koo, Frank Sinclair, Alexandre Likhanskii, Svetlana Radovanov, Alexander Perel, Graham Wright, Jay T. Scheuer, Daniel Tieger, You Chia Li, Jay Johnson, Tseh-Jen Hsieh, Ronald Johnson
  • Semiconductor probe pin
    Patent number: D1051865
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: November 19, 2024
    Assignee: POINT ENGINEERING CO., LTD.
    Inventor: Bum Mo Ahn
  • Circuit board
    Patent number: D1051866
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: November 19, 2024
    Assignee: FLEECE PERFORMANCE ENGINEERING, INC.
    Inventors: Brayden Fleece, Jeffrey W. Everett, Matthew Miller
  • Confinement liner for a substrate processing chamber
    Patent number: D1051867
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: November 19, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Joseph Perry
  • Circuit board
    Patent number: D1052544
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: November 26, 2024
    Assignee: FLEECE PERFORMANCE ENGINEERING, INC.
    Inventors: Brayden Fleece, Jeffrey W. Everett, Matthew Miller
  • Semiconductor device
    Patent number: D1052545
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: November 26, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Aiko Miyazaki, Takahiro Arakawa, Tomoyuki Kawakami, Satoshi Kobayashi
  • Cover ring of top plate for semiconductor manufacturing apparatus
    Patent number: D1052546
    Type: Grant
    Filed: February 15, 2023
    Date of Patent: November 26, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Takuto Umetsu, Masayoshi Yajima, Kunihiko Suzuki
  • Semiconductor wafer and susceptor heating
    Patent number: D1052547
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: November 26, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Kunihiko Suzuki, Takuto Umetsu
  • Gas diffuser
    Patent number: D1052548
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: November 26, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Devi Raghavee Veerappan, Xiaoxiong Yuan, Peiyu Zhang, Borui Xia, Chih-Hsun Hsu
  • Furnace for substrate processing apparatus
    Patent number: D1053156
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: December 3, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hideto Tateno, Takatomo Yamaguchi, Daiki Kimoto
  • Heat reflector for semiconductor manufacturing equipment
    Patent number: D1053157
    Type: Grant
    Filed: January 24, 2023
    Date of Patent: December 3, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Akihiro Sato
  • Sputter target for a physical vapor deposition chamber
    Patent number: D1053230
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: December 3, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Siew Kit Hoi, Jay Min Soh, Mengxue Wu, Palaniappan Chidambaram
  • Wafer support of semiconductor manufacturing apparatus
    Patent number: D1053830
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: December 10, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Daiki Taniguchi
  • Carrier substrate for handling
    Patent number: D1054388
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: December 17, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
  • Semiconductor device
    Patent number: D1054389
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: December 17, 2024
    Assignee: NEC Corporation
    Inventors: Tomohiro Yamaji, Kohei Matsuura
  • Semiconductor device
    Patent number: D1054390
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: December 17, 2024
    Assignee: NEC Corporation
    Inventors: Tomohiro Yamaji, Kohei Matsuura
  • Circuit board
    Patent number: D1054391
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: December 17, 2024
    Assignee: SHENZHEN FANTTIK TECHNOLOGY
    Inventor: Bo Du
  • Cellular module
    Patent number: D1054404
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: December 17, 2024
    Assignee: KONTRON EUROPE GMBH
    Inventor: Annette Horn
  • Support ring for an interlocking process kit for a substrate processing chamber
    Patent number: D1055006
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: December 24, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Sahiti Nallagonda, Jonathan Simmons, Xinwei Huang, Peter Muraoka, Andreas Schmid
  • Laptop motherboard
    Patent number: D1055007
    Type: Grant
    Filed: January 31, 2024
    Date of Patent: December 24, 2024
    Inventor: Haoyang Liu
  • Circuit board
    Patent number: D1055879
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: December 31, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Kenichi Nakazato
  • Power module
    Patent number: D1055880
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: December 31, 2024
    Assignee: Delta Electronics, Inc.
    Inventors: Jen-Hsien Wong, Han-Lin Wu, Chun-Liang Chiang, Tai-Kuang Lee
  • Power semiconductor module
    Patent number: D1056861
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: January 7, 2025
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Kenji Yamamoto, Yasunori Kutsuma
  • Semiconductor package
    Patent number: D1056862
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: January 7, 2025
    Assignee: Wolfspeed, Inc.
    Inventors: Geza Dezsi, Devarajan Balaraman, Brice McPherson
  • Circuit board
    Patent number: D1056863
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: January 7, 2025
    Assignee: The Noco Company
    Inventors: James P. McBride, Matthew Michael Bosway, V