Semiconductor, Transistor Or Integrated Circuit (24) Patents (Class D13/182)
  • Semiconductor device
    Patent number: D1052545
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: November 26, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Aiko Miyazaki, Takahiro Arakawa, Tomoyuki Kawakami, Satoshi Kobayashi
  • Cover ring of top plate for semiconductor manufacturing apparatus
    Patent number: D1052546
    Type: Grant
    Filed: February 15, 2023
    Date of Patent: November 26, 2024
    Assignee: NuFlare Technology, Inc.
    Inventors: Takuto Umetsu, Masayoshi Yajima, Kunihiko Suzuki
  • Furnace for substrate processing apparatus
    Patent number: D1053156
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: December 3, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hideto Tateno, Takatomo Yamaguchi, Daiki Kimoto
  • Heat reflector for semiconductor manufacturing equipment
    Patent number: D1053157
    Type: Grant
    Filed: January 24, 2023
    Date of Patent: December 3, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Akihiro Sato
  • Sputter target for a physical vapor deposition chamber
    Patent number: D1053230
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: December 3, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Siew Kit Hoi, Jay Min Soh, Mengxue Wu, Palaniappan Chidambaram
  • Wafer support of semiconductor manufacturing apparatus
    Patent number: D1053830
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: December 10, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Daiki Taniguchi
  • Carrier substrate for handling
    Patent number: D1054388
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: December 17, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
  • Semiconductor device
    Patent number: D1054389
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: December 17, 2024
    Assignee: NEC Corporation
    Inventors: Tomohiro Yamaji, Kohei Matsuura
  • Semiconductor device
    Patent number: D1054390
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: December 17, 2024
    Assignee: NEC Corporation
    Inventors: Tomohiro Yamaji, Kohei Matsuura
  • Circuit board
    Patent number: D1054391
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: December 17, 2024
    Assignee: SHENZHEN FANTTIK TECHNOLOGY
    Inventor: Bo Du
  • Cellular module
    Patent number: D1054404
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: December 17, 2024
    Assignee: KONTRON EUROPE GMBH
    Inventor: Annette Horn
  • Support ring for an interlocking process kit for a substrate processing chamber
    Patent number: D1055006
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: December 24, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Sahiti Nallagonda, Jonathan Simmons, Xinwei Huang, Peter Muraoka, Andreas Schmid
  • Laptop motherboard
    Patent number: D1055007
    Type: Grant
    Filed: January 31, 2024
    Date of Patent: December 24, 2024
    Inventor: Haoyang Liu
  • Circuit board
    Patent number: D1055879
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: December 31, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Kenichi Nakazato
  • Power module
    Patent number: D1055880
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: December 31, 2024
    Assignee: Delta Electronics, Inc.
    Inventors: Jen-Hsien Wong, Han-Lin Wu, Chun-Liang Chiang, Tai-Kuang Lee
  • Power semiconductor module
    Patent number: D1056861
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: January 7, 2025
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Kenji Yamamoto, Yasunori Kutsuma
  • Semiconductor package
    Patent number: D1056862
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: January 7, 2025
    Assignee: Wolfspeed, Inc.
    Inventors: Geza Dezsi, Devarajan Balaraman, Brice McPherson
  • Circuit board
    Patent number: D1056863
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: January 7, 2025
    Assignee: The Noco Company
    Inventors: James P. McBride, Matthew Michael Bosway, V
  • Pedestal for a substrate processing system
    Patent number: D1057675
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: January 14, 2025
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Gary B. Lind, Andrew Paul Eib
  • Reaction chamber base plate
    Patent number: D1059311
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: January 28, 2025
    Assignee: ASM IP Holding B.V.
    Inventors: Todd Dunn, Abhishek Mangoli, Ruchik Bhatt
  • Deposition ring of a process kit for semiconductor substrate processing
    Patent number: D1059312
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: January 28, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Abhishek Chowdhury, Nataraj Bhaskar Rao, Edwin C. Suarez, Harisha Sathyanarayana, Diego Ramiro Puente Sotomayor, Qanit Takmeel, Mohammad Kamruzzaman Chowdhury, Arun Chakravarthy Chakravarthy
  • Circuit board
    Patent number: D1059313
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: January 28, 2025
    Assignee: Canaan Creative Co., LTD.
    Inventors: Hongbin Mao, Nangeng Zhang
  • Circuit board with heat sink
    Patent number: D1059314
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: January 28, 2025
    Assignee: Canaan Creative Co., LTD.
    Inventors: Shaohua Zhang, Huan Yang, Nangeng Zhang
  • Package structure for a semiconductor element
    Patent number: D1059315
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: January 28, 2025
    Assignee: GaNrich Semiconductor Corporation
    Inventors: Jia-Tay Kuo, Chen-Yu Wang, Sheng-Bo Wang, Chiao Fu, Yao-Zhong Liu
  • Utility meter dual transceiver boards
    Patent number: D1060279
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: February 4, 2025
    Inventors: Michael Lee Gregory, Jason Edward Pintok, Ian Harvey
  • Light-emitting device
    Patent number: D1062026
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: February 11, 2025
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Yao-Ning Chan, Yi-Tang Lai, Yun-Chung Chou, Shih-Chang Lee, Chen Ou
  • CMP (chemical mechanical planarization) retaining ring
    Patent number: D1062662
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: February 18, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyungjoo Lee, Hyeondong Song
  • CMP (chemical mechanical planarization) retaining ring
    Patent number: D1063595
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: February 25, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyungjoo Lee, Hyeondong Song
  • Substrate lifter for semiconductor manufacturing equipment
    Patent number: D1063875
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: February 25, 2025
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tatsuki Jinden, Shinya Morita
  • Grounding ring of a process kit for semiconductor substrate processing
    Patent number: D1064005
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: February 25, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Abhishek Chowdhury, Nataraj Bhaskar Rao, Edwin C. Suarez, Harisha Sathyanarayana, Diego Ramiro Puente Sotomayor, Qanit Takmeel, Mohammad Kamruzzaman Chowdhury, Arun Chakravarthy Chakravarthy
  • Baffle for anti-rotation process kit for substrate processing chamber
    Patent number: D1066275
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: March 11, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rohan Vijay Rane, Xue Yang Chang, Timothy Joseph Franklin, Daniel Sang Byun
  • Process chamber pumping liner
    Patent number: D1066440
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: March 11, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Yang Li, Xi Cen, Kai Wu, Min-Han Lee, Mehran Behdjat
  • Susceptor
    Patent number: D1067204
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 18, 2025
    Assignee: ASM IP Holding B.V.
    Inventors: Shujin Huang, Junwei Su, Wentao Wang, Xing Lin
  • Circuit board
    Patent number: D1067206
    Type: Grant
    Filed: November 30, 2023
    Date of Patent: March 18, 2025
    Assignee: The Noco Company
    Inventors: James P. McBride, Matthew Michael Bosway
  • Semiconductor driving circuit module
    Patent number: D1068694
    Type: Grant
    Filed: September 21, 2023
    Date of Patent: April 1, 2025
    Assignee: TAMURA CORPORATION
    Inventors: Hirotoshi Aoki, Hiroo Ogawa, Kiyotaka Yoshida
  • Box for transporting boards
    Patent number: D1068700
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: April 1, 2025
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Cheng-En Chung, Chih-Ming Lin, Po-Ting Lee, Wei-Chien Liu, Tzu-Ning Huang
  • Box for transporting boards
    Patent number: D1068701
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: April 1, 2025
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Ming-Chien Chiu, Yung-Chin Pan, Cheng-En Chung, Chih-Ming Lin, Po-Ting Lee, Wei-Chien Liu, Tzu-Ning Huang
  • Optical engine
    Patent number: D1069740
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: April 8, 2025
    Assignee: WINGCOMM CO. LTD.
    Inventors: Jing Ge, Jie Ge, Zuodong Wang, Wei Mao, Yun Bai
  • Deposition ring of a process kit for semiconductor substrate processing
    Patent number: D1069863
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: April 8, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Abhishek Chowdhury, Nataraj Bhaskar Rao, Edwin C. Suarez, Harisha Sathyanarayana, Diego Ramiro Puente Sotomayor, Qanit Takmeel, Mohammad Kamruzzaman Chowdhury, Arun Chakravarthy Chakravarthy
  • Light-emitting diode package
    Patent number: D1070144
    Type: Grant
    Filed: May 22, 2023
    Date of Patent: April 8, 2025
    Assignee: CreeLED, Inc.
    Inventors: JuZuo Sheng, Xiang Fei, Robert David Schmidt
  • Stamp component for transferring microstructure
    Patent number: D1070795
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: April 15, 2025
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
  • Stamp component for transferring microstructure
    Patent number: D1070796
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: April 15, 2025
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Ogawa, Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi Kitagawa
  • Furnace for substrate processing apparatus
    Patent number: D1070797
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: April 15, 2025
    Assignee: Kokusai Electric Corporation
    Inventors: Hideto Tateno, Takatomo Yamaguchi, Daiki Kimoto
  • Semiconductor driving circuit module
    Patent number: D1071876
    Type: Grant
    Filed: September 21, 2023
    Date of Patent: April 22, 2025
    Assignee: TAMURA CORPORATION
    Inventors: Hirotoshi Aoki, Hiroo Ogawa, Kiyotaka Yoshida
  • Substrate support for a substrate processing chamber
    Patent number: D1071886
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: April 22, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Zhixiu Liang, Michael Sterling Jackson, Jiang Lu, Cheng-Hsiung Matthew Tsai, Tomoharu Matsushita, Zubin Huang
  • Composite seal for semiconductor manufacturing device
    Patent number: D1071887
    Type: Grant
    Filed: July 25, 2023
    Date of Patent: April 22, 2025
    Inventors: Nobuhiro Yoshida, Tamotsu Matsumura
  • Target profile for a physical vapor deposition chamber target
    Patent number: D1072774
    Type: Grant
    Filed: February 6, 2021
    Date of Patent: April 29, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shane Lavan, Madan Kumar Shimoga Mylarappa, Sundarapandian Ramalinga Vijayalakshmi Reddy, Avinash Nayak, Wei Dou, Yong Cao, Kirankumar Neelasandra Savandaiah, Mingdong Li
  • Waveguide converter
    Patent number: D1072775
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: April 29, 2025
    Assignee: KYOCERA CORPORATION
    Inventor: Akihiro Maeda
  • Power module
    Patent number: D1073632
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: May 6, 2025
    Assignee: WOLFSPEED, INC.
    Inventors: Brice McPherson, Brandon Passmore, Roberto M. Schupbach, Jennifer Stabach-Smith
  • Baffle for substrate processing system
    Patent number: D1073758
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: May 6, 2025
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Karthik Adappa Sathish, Cody Barnett, Mitali Mrigendra Basargi, Ravi Kumar