Electronic instrument housing
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FIG. 1 is a front elevational view of an electronic instrument housing showing my new design, the rear elevational view being identical;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof, the left side elevational view being identical;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a cross-sectional view in elevational taken along the line 5--5 of FIG. 2;
FIG. 6 is a front elevational view of a second embodiment of my electronic instrument housing similar to FIG. 1 with the right side elevational view and the bottom view being the same as in FIGS. 3 and 4 except for the proportions thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a front elevational view of a third embodiment of my electronic instrument housing of this invention similar to FIG. 1 with the side elevational view and the bottom view being the same as FIGS. 3 and 4, except for the proportions thereof;
FIG. 9 is a top plan view thereof;
FIG. 10 is a front elevational view of a fourth embodiment of my form of electronic instrument housing in accordance with this invention similar to FIG. 1 wherein the front panel shows a reveal around its edge, all other figures corresponding to FIGS. 2-4 thereof; and,
FIG. 11 is a partial cross-sectional view in elevation taken along the line 11--11 of FIG. 10 to show the front panel reveal thereof.
Type: Grant
Filed: Oct 28, 1994
Date of Patent: Dec 26, 1995
Assignee: LaFrance Corporation (Philadelphia, PA)
Inventor: Peter A. Peroni (Pottstown, PA)
Primary Examiner: Joel Sincavage
Law Firm: Connolly & Hutz
Application Number: 0/28,313