Overmolded housing for an interface cable

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Description

FIG. 1 is a perspective view showing a top, right, and front side of a preferred embodiment of our new design for an overmolded housing for an interface cable in accordance with the present invention;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a rear elevational view thereof.

The broken line showing throughout the drawing figures is included for the purpose of illustrating environmental structure only and forms no part of the claimed design.

Referenced Cited
U.S. Patent Documents
D332251 January 5, 1993 Meinel
D356293 March 14, 1995 Riley et al.
3020518 February 1962 Camping et al.
4445742 May 1, 1984 Fullam
4585290 April 29, 1986 Knickerbocker et al.
4704091 November 3, 1987 Owens et al.
Patent History
Patent number: D373567
Type: Grant
Filed: Jun 30, 1995
Date of Patent: Sep 10, 1996
Inventors: Roman P. Rak (Delta, British Columbia), William E. Fenton (Surrey, British Columbia)
Primary Examiner: Joel Sincavage
Attorneys: Charles W. Bethards, Kevin A. Buford
Application Number: 0/40,946
Classifications
Current U.S. Class: Connector, Conductor Or Housing Therefor (10) (D13/133)