IC module
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Description
FIG. 1 is a front, bottom and right side perspective view of an IC module, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof, the opposite side being a mirror image;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a rear elevational view thereof.
Referenced Cited
Patent History
Patent number: D387747
Type: Grant
Filed: Nov 27, 1996
Date of Patent: Dec 16, 1997
Assignee: Kabushiki Kaisha Toshiba (Kawasaki)
Inventor: Tomiaki Ishihara (Yokohama)
Primary Examiner: Kay H. Chin
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 0/62,839
Type: Grant
Filed: Nov 27, 1996
Date of Patent: Dec 16, 1997
Assignee: Kabushiki Kaisha Toshiba (Kawasaki)
Inventor: Tomiaki Ishihara (Yokohama)
Primary Examiner: Kay H. Chin
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 0/62,839
Classifications
Current U.S. Class:
D14/114;
D14/117
International Classification: 1402;
International Classification: 1402;