IC module

- Kabushiki Kaisha Toshiba
Description

FIG. 1 is a perspective view of the front, bottom and right side elevational view of an IC module, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof, the bottom plan view is identical; and,

FIG. 6 is a rear elevational view thereof.

Referenced Cited
U.S. Patent Documents
D353135 December 6, 1994 Gloton
D357242 April 11, 1995 Gloton
D357909 May 2, 1995 Gloton
D358142 May 9, 1995 Gloton
5049728 September 17, 1991 Roviu
5375037 December 20, 1994 Le Roux
Foreign Patent Documents
M9308049 February 1994 DEX
761367 May 1989 JPX
780452 January 1991 JPX
815301 August 1991 JPX
865665 April 1993 JPX
Other references
  • Official Gazette, design patent D331922, p. 2439, Dec. 22, 1992. Official Gazette, design patent D328599, p. 1377, Aug. 11, 1992.
Patent History
Patent number: D368903
Type: Grant
Filed: Mar 16, 1995
Date of Patent: Apr 16, 1996
Assignee: Kabushiki Kaisha Toshiba (Kawasaki)
Inventors: Jun Ohmori (Tokyo), Hiroshi Iwasaki (Yokohama)
Primary Examiner: M. H. Tung
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt
Application Number: 0/36,254
Classifications
Current U.S. Class: D14/117