Headphone
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FIG. 1 is a perspective view of a first embodiment of a headphone showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a bottom plan elevational view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a top plan view thereof wherein the covers are in the open position;
FIG 9 is a front elevational view thereof wherein the covers are in the open position;
FIG. 10 is a perspective view of a second embodiment of a headphone showing my new design;
FIG. 11 is a top plan view of the embodiment of FIG. 10;
FIG. 12 is a front elevational view of the embodiment of FIG. 10;
FIG. 13 is a right side elevational view of the embodiment of FIG. 10;
FIG. 14 is a left side elevational view of the embodiment of FIG. 10;
FIG. 15 is a bottom plan view of the embodiment of FIG. 10;
FIG. 16 is a rear elevational view of the embodiment of FIG. 10;
FIG. 17 is a top plan view of the embodiment of FIG. 10 wherein the covers are in the open position; and,
FIG. 18 is a front elevational view of the embodiment of FIG. 10 wherein the covers are in the open position.
Type: Grant
Filed: Sep 6, 1996
Date of Patent: Mar 3, 1998
Assignee: Sony Corporation (Tokyo)
Inventor: Mitsuhiro Nakamura (Tokyo)
Primary Examiner: Ted Shooman
Assistant Examiner: Nanda Bondade
Law Firm: Foley & Lardner
Application Number: 0/59,291
