Headphone

- Sony Corporation
Description

FIG. 1 is a perspective view of a first embodiment of a headphone showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a left side elevational view thereof;

FIG. 8 is a perspective view of a second embodiment of a headphone showing our new design;

FIG. 9 is a top plan view of the embodiment of FIG. 8;

FIG. 10 is a front elevational view of the embodiment of FIG. 8;

FIG. 11 is a right side elevational view of the embodiment of FIG. 8;

FIG. 12 is a bottom plan view of the embodiment of FIG. 8;

FIG. 13 is a rear elevational view of the embodiment of FIG. 8;

FIG. 14 is a left side elevational view of the embodiment of FIG. 8; and,

FIG. 15 is a reference perspective view wherein the embodiment of FIG. 8 is in the using condition. The person and cord portions in broken lines are for illustrative purposes only and form no part of claimed design.

Referenced Cited
U.S. Patent Documents
D331057 November 17, 1992 Isonaga
D331059 November 17, 1992 Sogabe et al.
D347845 June 14, 1994 Sumikawa
Patent History
Patent number: D399206
Type: Grant
Filed: Sep 2, 1997
Date of Patent: Oct 6, 1998
Assignee: Sony Corporation (Tokyo)
Inventors: Hiroshi Yasutomi (Tokyo), Mitsuhiro Nakamura (Tokyo)
Primary Examiner: Sandra L. Morris
Assistant Examiner: Nanda Bondade
Law Firm: Foley & Lardner
Application Number: 0/75,537
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)
International Classification: 1401;