Headphone
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FIG. 1 is a perspective view of a first embodiment of a headphone showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a left side elevational view thereof;
FIG. 8 is a perspective view of a second embodiment of a headphone showing our new design;
FIG. 9 is a top plan view of the embodiment of FIG. 8;
FIG. 10 is a front elevational view of the embodiment of FIG. 8;
FIG. 11 is a right side elevational view of the embodiment of FIG. 8;
FIG. 12 is a bottom plan view of the embodiment of FIG. 8;
FIG. 13 is a rear elevational view of the embodiment of FIG. 8;
FIG. 14 is a left side elevational view of the embodiment of FIG. 8; and,
FIG. 15 is a reference perspective view wherein the embodiment of FIG. 8 is in the using condition. The person and cord portions in broken lines are for illustrative purposes only and form no part of claimed design.
Type: Grant
Filed: Sep 2, 1997
Date of Patent: Oct 6, 1998
Assignee: Sony Corporation (Tokyo)
Inventors: Hiroshi Yasutomi (Tokyo), Mitsuhiro Nakamura (Tokyo)
Primary Examiner: Sandra L. Morris
Assistant Examiner: Nanda Bondade
Law Firm: Foley & Lardner
Application Number: 0/75,537