Leading wire

- Sony Corporation
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Description

FIG. 1 is a perspective view of a leading wire showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof, the left side elevational view being a mirror image;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a rear elevational view thereof.

Referenced Cited
U.S. Patent Documents
368765 August 1887 Hammer
482012 September 1892 Knowles
1073670 September 1913 Ford
1373241 March 1921 Heberling et al.
1560308 October 1925 Perry
3587030 June 1971 Ohmsorg
3706955 December 1972 Bunnell
4973370 November 27, 1990 Kreinberg
5071368 December 10, 1991 Garritano et al.
5154646 October 13, 1992 Shoup
5541380 July 30, 1996 Ogden et al.
Patent History
Patent number: D400169
Type: Grant
Filed: Mar 26, 1996
Date of Patent: Oct 27, 1998
Assignee: Sony Corporation (Tokyo)
Inventor: Syuuei Endo (Fukushima)
Primary Examiner: Joel Sincavage
Law Firm: Foley & Lardner
Application Number: 0/52,196
Classifications
Current U.S. Class: Connector (e.g., Terminal, Clamp, Etc.) (4) (D13/120); Cable, Wire Or Cladding Therefor (17) (D13/153)
International Classification: 1303;