Earphone
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FIG. 1 is a perspective view of a first embodiment of a earphone showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a perspective view of a second embodiment of a earphone showing my new design;
FIG. 9 is a top plan view of the embodiment of FIG. 8;
FIG. 10 is a left side elevational view of the embodiment of FIG. 8;
FIG. 11 is a front elevational view of the embodiment of FIG. 8;
FIG. 12 is a bottom plan view of the embodiment of FIG. 8;
FIG. 13 is a right side elevational view of the embodiment of FIG. 8; and,
FIG. 14 is a rear elevational view of the embodiment of FIG. 8.
Type: Grant
Filed: Mar 19, 1997
Date of Patent: Dec 15, 1998
Assignee: Sony Corporation (Tokyo)
Inventor: Haruo Hayashi (Tokyo)
Primary Examiner: Ted Shooman
Assistant Examiner: Nanda Bondade
Law Firm: Foley & Lardner
Application Number: 0/70,951
