Headphone

- Sony Corporation

Description

FIG. 1 is a perspective view of a first embodiment of a headphone showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a perspective view of a second embodiment of a headphone showing my new design;

FIG. 9 is a top plan view thereof;

FIG. 10 is a left side elevational view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side elevational view thereof; and,

FIG. 14 is a rear elevational view thereof.

Referenced Cited

U.S. Patent Documents

D358390 May 16, 1995 Hayashi
D359049 June 6, 1995 Kanno
D381987 August 5, 1997 Tsuge
5406037 April 11, 1995 Nageno

Patent History

Patent number: D409197
Type: Grant
Filed: Feb 12, 1998
Date of Patent: May 4, 1999
Assignee: Sony Corporation (Tokyo)
Inventor: Mitsuhiro Nakamura (Tokyo)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Nanda Bondade
Law Firm: Foley & Lardner
Application Number: 0/83,577

Classifications

Current U.S. Class: Headphone Or Headset (D14/205)
International Classification: 1401;