Machine for forming a semiconductor wafer film

- Tokyo Electron Limited
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Description

FIG. 1 is a front elevational view of machine for forming a semiconductor wafer film, showing my new design;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
5311103 May 10, 1994 Asmussen et al.
5863327 January 26, 1999 Thakur
Patent History
Patent number: D414503
Type: Grant
Filed: Mar 20, 1998
Date of Patent: Sep 28, 1999
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Susumu Katoh (Yamanashi-ken)
Primary Examiner: Antoine Duval Davis
Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 0/85,326
Classifications
Current U.S. Class: D15/1441; Electrical Property (D10/75)
International Classification: 1509;