Case for semiconductor element
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FIG. 1 is a perspective view of a first embodiment of a case for semiconductor element showing my new design;
FIG. 2 is a top plan view of the first embodiment;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof; and
FIG. 8 is a perspective view of the first embodiment, wherein the broken-line disclosure of the two inserted electronic components is for illustrative purposes only and forms no part of the claimed design;
FIG. 9 is a perspective view of a second embodiment of a case for semiconductor element showing my new design;
FIG. 10 is a top plan view of the second embodiment;
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a front elevational view thereof;
FIG. 13 is a bottom plan view thereof;
FIG. 14 is a right side elevational view thereof;
FIG. 15 is a rear elevational view thereof; and,
FIG. 16 is a perspective view of the first embodiment, wherein the broken-line disclosure of the two inserted electronic components is for illustrative purposes only and forms no part of the claimed design.
Type: Grant
Filed: Feb 6, 1998
Date of Patent: Nov 30, 1999
Assignee: Sony Corporation (Tokyo)
Inventor: Haruo Oba (Tokyo)
Primary Examiner: Brian N. Vinson
Law Firm: Foley & Lardner
Application Number: 0/83,169
International Classification: 1499;