Front surface of a stampless envelope

- E-Stamp Corporation
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Description

FIG. 1 is a front elevational view of a front surface of a stampless envelope showing my new design; and,

FIG. 2 is a front elevational view of an alternate embodiment of my design of FIG. 1.

The indicia depicted by means of broken lines in the upper left hand corner of FIG. 2 has been shown for illustrative purposes only and forms no part of the claimed design.

Referenced Cited
U.S. Patent Documents
D380007 June 17, 1997 Kara
D384098 September 23, 1997 Kara
D386783 November 25, 1997 Kara
D395333 June 16, 1998 Kara
701839 June 1902 Callahan
1988908 January 1935 Mackinnon
2035218 March 1936 Bloom
2794590 June 1957 Sills, Jr.
2804395 August 1957 Boyajian
2825498 March 1958 Alves
2985464 May 1961 McFarland
3221980 December 1965 Mercur
3380648 April 1968 De Lyra
3902656 September 1975 Rothchild
3986662 October 19, 1976 Luftig
4245775 January 20, 1981 Conn
4502713 March 5, 1985 Conti
4919324 April 24, 1990 Hottle
5507526 April 16, 1996 Petkovsek
Patent History
Patent number: D421048
Type: Grant
Filed: Jun 4, 1999
Date of Patent: Feb 22, 2000
Assignee: E-Stamp Corporation (San Mateo, CA)
Inventor: Salim G. Kara (Houston, TX)
Primary Examiner: Martie K. Holtje
Law Firm: Fulbright & Jaworski L.L.P.
Application Number: 0/106,005
Classifications
Current U.S. Class: Envelope (D19/3)
International Classification: 1901;