Bubble package
FIG. 1 is a front elevational view of a bubble package showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a front elevational view of a second embodiment of the bubble package;
FIG. 8 is a rear elevational view of FIG. 7;
FIG. 9 is a left side elevational view of FIG. 7;
FIG. 10 is a right side elevational view of FIG. 7;
FIG. 11 is a bottom plan view of FIG. 7;
FIG. 12 is a top plan view of FIG. 7;
FIG. 13 is a front elevational view of a third embodiment of the bubble package;
FIG. 14 is a rear elevational view of FIG. 13;
FIG. 15 is a left side evelational view of FIG. 13;
FIG. 16 is a right side elevational view of FIG. 13;
FIG. 17 is a bottom plan view of FIG. 13; and,
FIG. 18 is a top plan view of FIG. 13.
| D355600 | February 21, 1995 | Ford |
| D371071 | June 25, 1996 | Frod |
| D405368 | February 9, 1999 | Lee |
| 4278693 | July 14, 1981 | Dingethal et al. |
| 4469226 | September 4, 1984 | Matney |
| 5890593 | April 6, 1999 | Humphrey |
- Modern Packaging Catalog, p. 300, Jan. 1941. Techform Inc. (From 206/461 Shoe), Nov. 1982.
Type: Grant
Filed: Dec 15, 1998
Date of Patent: Oct 3, 2000
Assignee: Monster Cable, Inc. (Sunnyvale, CA)
Inventor: Kendrew Lee (San Jose, CA)
Primary Examiner: Prabhakar Deshmukh
Law Firm: Lariviere, Grubman & Payne, LLP
Application Number: 0/97,848
International Classification: 0903;
