Crimp terminal
Latest Japan Solderless Terminal Mfg. Co., Ltd Patents:
Description
FIG. 1 is a top plan view of a crimp terminal;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a sectional view taken on line 4--4 of FIG. 1;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a perspective view thereof.
Referenced Cited
Patent History
Patent number: D434375
Type: Grant
Filed: Aug 25, 1999
Date of Patent: Nov 28, 2000
Assignee: Japan Solderless Terminal Mfg. Co., Ltd
Inventor: Hideo Kawamoto (Kanagawa)
Primary Examiner: Joel Sincavage
Law Firm: Rader, Fishman & Grauer
Application Number: 0/109,948
Type: Grant
Filed: Aug 25, 1999
Date of Patent: Nov 28, 2000
Assignee: Japan Solderless Terminal Mfg. Co., Ltd
Inventor: Hideo Kawamoto (Kanagawa)
Primary Examiner: Joel Sincavage
Law Firm: Rader, Fishman & Grauer
Application Number: 0/109,948
Classifications
Current U.S. Class:
Connector, Conductor Or Housing Therefor (10) (D13/133);
Compressive Engagement (e.g., Clamped, Crimped, Etc.) (15) (D13/149)
International Classification: 1303;
International Classification: 1303;