IC module
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Description
FIG. 1 is a perspective view of the front, bottom and right side of an IC module showing my new design;
FIG. 2 is a perspective view of the rear, bottom and left side thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof; and,
FIG. 8 is a left side elevational view thereof.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D434418
Type: Grant
Filed: Oct 6, 1999
Date of Patent: Nov 28, 2000
Assignee: Seiko Epson Corporation (Tokyo)
Inventor: Satoshi Shinada (Nagano)
Primary Examiner: M. H. Tung
Law Firm: Stroock & Stroock & Lavan LLP
Application Number: 0/111,928
Type: Grant
Filed: Oct 6, 1999
Date of Patent: Nov 28, 2000
Assignee: Seiko Epson Corporation (Tokyo)
Inventor: Satoshi Shinada (Nagano)
Primary Examiner: M. H. Tung
Law Firm: Stroock & Stroock & Lavan LLP
Application Number: 0/111,928
Classifications