Package for electronic device

- IBM
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Description

FIG. 1 is a perspective view of a package for electronic device showing our new design when the package is opened;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view our design for a package for electronic device when the package is closed.

Claims

The ornamental design for a package for electronic device, as shown and described.

Referenced Cited
U.S. Patent Documents
D375458 November 12, 1996 Drinnen
D395234 June 16, 1998 Shida et al.
3923152 December 1975 Minneman
4220252 September 2, 1980 Beall et al.
4997100 March 5, 1991 Dudek
5341926 August 30, 1994 Leben
5543114 August 6, 1996 Dudek
5727688 March 17, 1998 Ishii et al.
5769260 June 23, 1998 Killinger et al.
Patent History
Patent number: D440489
Type: Grant
Filed: Apr 25, 2000
Date of Patent: Apr 17, 2001
Assignee: IBM Japan Business Logistics Co., Ltd. (Tokyo)
Inventors: Hideo Igami (Fujisawa), Yuhta Ishii (Machida)
Primary Examiner: Prabhakar Deshmukh
Attorney, Agent or Law Firm: Varndell & Varndell, PLLC
Application Number: 29/122,268
Classifications
Current U.S. Class: D9/426; D9/423
International Classification: 0903;