Insertable control module
Latest Siemens Aktiengesellschaft Patents:
- Network Node Point and Method for Linking Different Input Devices
- Verification of Data of an Authentication and Key-Agreement Protocol Process
- Workflow Execution Methods and Apparatus, Storage Medium, and Program Product
- SEMICONDUCTOR ASSEMBLY HAVING A SEMICONDUCTOR ELEMENT AND A SUBSTRATE
- CIRCUIT ASSEMBLY WITH A CIRCUIT CARRIER AND A SEMICONDUCTOR COMPONENT
FIG. 1 is a top view of a first embodiment of an insertable control module showing a top face thereof;
FIG. 2 is a bottom view of the insertable control module shown in FIG. 1;
FIG. 3 is a top view of a second embodiment of the insertable control module showing a top face thereof;
FIG. 4 is a bottom view of the insertable control module shown in FIG. 3;
FIG. 5 is a top view of a third embodiment of the insertable control module showing a top face thereof;
FIG. 6 is a front view of the insertable control module;
FIG. 7 is a rear view of the insertable control module;
FIG. 8 is a left view of the insertable control module; and,
FIG. 9 is a right view of the insertable control module.
The details shown in broken lines in FIG. 2 are shown for illustrative purposes only and form no part of the claimed design.
Claims
An ornamental design for an insertable control module, as shown and described.
Type: Grant
Filed: Nov 5, 1999
Date of Patent: May 8, 2001
Assignee: Siemens Aktiengesellschaft (Muchen)
Inventor: Jens Pattberg (Gauting)
Primary Examiner: Brian N. Vinson
Attorney, Agent or Law Firm: Birch, Stewart, Kolasch, & Birch, LLP
Application Number: 29/113,475
