Processor and display module for a modular measurement instrument
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The ornamental design disclosed in this application is for a processor and display module for a modular for a modular measurement instrument having raised bumper guards at the corners of the module, and a bi-level rear surface.
FIG. 1 is a perspective view of a processor and display module for a modular measurement instrument;
FIG. 2 is a front elevation view of the processor and display module for a modular measurement instrument;
FIG. 3 is a rear elevation view of the processor and display module for a modular measurement instrument;
FIG. 4 is a left side elevation view of the processor and display module for a modular measurement instrument;
FIG. 5 is a right side elevation view of the processor and display module for a modular measurement instrument.
FIG. 6 is a top plan view of the processor and display module for a modular measurement instrument; and,
FIG. 7 is a bottom plan view of the processor and display module for a modular measurement instrument.
Claims
The ornamental design for a processor and display module for a modular measurement instrument, as shown and described.
Type: Grant
Filed: Mar 13, 2000
Date of Patent: Jun 12, 2001
Assignee: Tektronix, Inc. (Beaverton, OR)
Inventors: Jerry L. Wrisley (Beaverton, OR), James H. McGrath, Jr. (Aloha, OR)
Primary Examiner: Antoine Duval Davis
Attorney, Agent or Law Firms: William K. Bucher, Francis I. Gray
Application Number: 29/120,012