Mold produced housing for enclosing the connection between a cable and a connector

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Description

FIG. 1 is a front elevational view of a mold produced housing for enclosing the connection between a cable and a connector showing my new design.

FIG. 2 is a rear elevational view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

The broken lines in FIG. 1 are included for the purpose of illustrating environmental structure only and form no part of the claimed design.

Claims

The ornamental design for a mold produced housing for enclosing the connection between a cable and a connector, as shown and described.

Referenced Cited
U.S. Patent Documents
D298931 December 13, 1988 Sekiguchi
D320001 September 17, 1991 Hirabayashi
D334173 March 23, 1993 Liu et al.
D399189 October 6, 1998 Lin
D411175 June 22, 1999 Doren et al.
D412883 August 17, 1999 Nakazawa
D413100 August 24, 1999 Nakazawa
D425487 May 23, 2000 Lee
4493525 January 15, 1985 Hall et al.
4611878 September 16, 1986 Hall et al.
4637669 January 20, 1987 Tajima
4650270 March 17, 1987 Tajima et al.
4741708 May 3, 1988 Yoshida
4824402 April 25, 1989 Sorimachi
5417585 May 23, 1995 Morin et al.
Patent History
Patent number: D444772
Type: Grant
Filed: Nov 10, 2000
Date of Patent: Jul 10, 2001
Inventor: Henry Milan (Rochester Hills, MI)
Primary Examiner: Joel Sincavage
Attorney, Agent or Law Firm: Marshall & Melhorn, LLC
Application Number: 29/132,526
Classifications