Abstract: A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g., 661 and 663) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g., 662). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.
Type:
Grant
Filed:
November 10, 2022
Date of Patent:
November 28, 2023
Assignee:
Molex, LLC
Inventors:
Teng-Kai Chen, John C. Laurx, Li Zhuang
Inventors:
Christopher G. Alviar, Neal Stanley Clark, Barry D. Curtin, Neil G. McIlvaine, Peter Nazaroff, Zack Pahlman, Jeremy Wong, Christian Schneider
Inventors:
Christopher Alviar, Ryan Bowman, Cathlene Buchanan, Kristina Edmonson, Brendan Greetham, Jeremy Wong, Nikolaos Kalogeropoulos, Christian Schneider
Assignees:
United States Goverment As Represented By The Department Of Veterans Affairs, University of Pittsburgh—Of the Commonwealth System of Higher Education
Inventors:
Jonathan Aaron Duvall, Rory A. Cooper, Garrett G. Grindle, Joshua David Kanode, Douglas A. Hilliard