Mold produced housing for enclosing the connection between a cable and a connector

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Description

FIG. 1 is a front elevational view of a mold produced housing for enclosing the connection between a cable and a connector showing my new design.

FIG. 2 is a rear elevational view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

The broken line environmental showing is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a mold produced housing for enclosing the connection between a cable and a connector, as shown and described.

Referenced Cited
U.S. Patent Documents
D402266 December 8, 1998 Siemon et al.
D429484 August 15, 2000 Nishio et al.
5334044 August 2, 1994 Falossi et al.
5620335 April 15, 1997 Siemon
Patent History
Patent number: D451888
Type: Grant
Filed: Nov 10, 2000
Date of Patent: Dec 11, 2001
Inventor: Henry Milan (Rochester Hills, MI)
Primary Examiner: Jennifer Rivard
Attorney, Agent or Law Firm: Marshall & Melhorn, LLC
Application Number: 29/132,536