Heat dissipating assembly

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Description

FIG. 1 is a perspective view of a heat dissipating assembly, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipating assembly, as shown.

Referenced Cited
U.S. Patent Documents
5368094 November 29, 1994 Hung
5486980 January 23, 1996 Jordan et al.
5495392 February 27, 1996 Shen
5664624 September 9, 1997 Tsai et al.
5724228 March 3, 1998 Lee
5960862 October 5, 1999 Hu
D425030 May 16, 2000 Hsieh
6332251 December 25, 2001 Ho et al.
Patent History
Patent number: D465771
Type: Grant
Filed: Jul 24, 2001
Date of Patent: Nov 19, 2002
Inventor: Hsin-Mao Hsieh (Pingtung City, Pingtung Hsien)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Thorp Reed & Armstrong LLP
Application Number: 29/145,512
Classifications
Current U.S. Class: Heat Sink (D13/179)
International Classification: 1303;