Heat dissipating assembly
Description
FIG. 1 is a perspective view of a heat dissipating assembly, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims
The ornamental design for a heat dissipating assembly, as shown.
Referenced Cited
Patent History
Patent number: D465771
Type: Grant
Filed: Jul 24, 2001
Date of Patent: Nov 19, 2002
Inventor: Hsin-Mao Hsieh (Pingtung City, Pingtung Hsien)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Thorp Reed & Armstrong LLP
Application Number: 29/145,512
Type: Grant
Filed: Jul 24, 2001
Date of Patent: Nov 19, 2002
Inventor: Hsin-Mao Hsieh (Pingtung City, Pingtung Hsien)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Thorp Reed & Armstrong LLP
Application Number: 29/145,512
Classifications