Heat dissipating RF electronics housing

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Description

FIG. 1 is a perspective photographic view from a first side of the electronics housing according to the invention.

FIG. 2 is a perspective photographic view from the opposite side of the housing according to FIG. 1.

FIG. 3 is a top photographic view of the housing according to FIG. 1.

FIG. 4 is a side photographic view of the housing according to FIG. 1.

FIG. 5 is a perspective photographic view from an end of the housing according to FIG. 1.

FIG. 6 is an end view of the housing according to FIG. 5; and,

FIG. 7 is a photographic view of the bottom of the housing according to FIG. 1.

Claims

The ornamental design for a heat dissipating RF electronics housing, as shown and described.

Referenced Cited
U.S. Patent Documents
4541004 September 10, 1985 Moore
5358032 October 25, 1994 Arai et al.
5509465 April 23, 1996 Lai
5581442 December 3, 1996 Morosas
D387333 December 9, 1997 Pellow et al.
5862038 January 19, 1999 Suzuki et al.
5964285 October 12, 1999 Huang
D423502 April 25, 2000 Lanclos
6055159 April 25, 2000 Sun
6295202 September 25, 2001 Tucker et al.
Other references
  • HyperLink Technologies, Inc., “HyperAmp™ HA2401A,” Jan. 20, 2001, Web Article: www.hyperlinktech.com/html/products/ha2401a.html.
  • Young Design, Inc., “AMP 2440,” Jan. 20, 2001, Web Article: www.ydi.com/Products/Amplifiers/AMP2440/amp2440.html.
Patent History
Patent number: D471168
Type: Grant
Filed: Jan 7, 2002
Date of Patent: Mar 4, 2003
Assignee: Teletronics International (Rockville, MD)
Inventors: David Ge (Potomac, MD), Mohammed Nusrat Jamal (Germantown, MD)
Primary Examiner: James Gandy
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Cahn & Samuels, LLP
Application Number: 29/152,997
Classifications
Current U.S. Class: Casing Or Enclosure Not Elsewhere Specified (D13/184)
International Classification: 1303;