Housing for electronic equipment components
A portion of the disclosure of this design patent document contains material which is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the U.S. Patent and Trademark Office patent files or records, but otherwise reserves all copyright rights whatsoever.
FIG. 1 is a perspective view of a first embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 2 is a top view of a first embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 3 is a side view of a first embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 4 is a bottom view of a first embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 5 is a corresponding side view of a first embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 6 is a rear view of a first embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 7 is a front view of a first embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 8 is a perspective view of FIG. 1 showing an alternate arrangement of environment;
FIG. 9 is a rear elevation of FIG. 1 showing an alternate arrangement of environment;
FIG. 10 is a front elevation of FIG. 1 showing the alternate arrangement of environment in FIG. 8:
FIG. 11 is a perspective view of a second embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 12 is a top view of a second embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 13 is a side view of a second embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 14 is a bottom view of a second embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 15 is a corresponding side view of a second embodiment of a housing for electronic equipment components, in accordance with the present invention.
FIG. 16 is a rear view of a second embodiment of a housing for electronic equipment components, in accordance with the present invention; and,
FIG. 17 is a front view of a second embodiment of a housing for electronic equipment components, in accordance with the present invention.
The broken lines are for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for housing for electronic equipment components, as shown in the accompanying drawings.
Type: Grant
Filed: Jan 8, 2003
Date of Patent: Oct 28, 2003
Assignee: Monster Power, LLC (Las Vegas, NV)
Inventor: Kendrew Lee (Fremont, CA)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: LaRiviere, Grubman & Payne, LLP
Application Number: 29/173,983
International Classification: 1303;
