Set of modules for a modular mount for circuit boards
FIG. 1 is a perspective view from above, of an intermediate module of the set of modules for modular mount for circuit boards showing my design;
FIG. 2 is a perspective view from below, of the modular mount of FIG. 1;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an end view from one end thereof, the other end being a mirror image thereof;
FIG. 6 is a side elevational view one side thereof, the other side being a mirror image thereof;
FIG. 7 is a perspective view of an end module of the set of modules for modular mount for circuit boards of FIG. 1 as viewed from its outer face;
FIG. 8 is a perspective view of the end module of FIG. 7, as viewed from its inner face;
FIG. 9 is a bottom plan view of the end module of FIG. 7;
FIG. 10 is an end view of the end module of FIG. 7 from its inner face;
FIG. 11 is an end elevational view of the top module of FIG. 7 from its outer face;
FIG. 12 is a side elevational view of the end module of FIG. 7; and,
FIG. 13 is a side elevational view of the end module of FIG. 7 from its outer face.
Claims
The ornamental design for a set of modules for a modular mount for circuit boards, as shown and described.
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Type: Grant
Filed: May 21, 2002
Date of Patent: Apr 6, 2004
Assignee: Camden Electronics Ltd.
Inventor: Andrew Hatter (St. Albans)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Hayes Soloway P.C.
Application Number: 29/161,049
International Classification: 1303;
