Housing for electronic device

- D-Link Systems, Inc.
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Description

FIG. 1 is a side elevation of a housing for electronic device showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a side elevation of the side opposite that shown in FIG. 1;

FIG. 4 is an end elevation thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is an end elevation of the end opposite that shown in FIG. 4; and,

FIG. 7 is a perspective view thereof.

Claims

We claim the ornamental design for a housing for electronic device, as shown.

Referenced Cited
U.S. Patent Documents
D291310 August 11, 1987 Ogura
D348070 June 21, 1994 Vallillee
D351841 October 25, 1994 Blankenship et al.
D363722 October 31, 1995 Aldridge et al.
D373125 August 27, 1996 Khoo
D374673 October 15, 1996 Beaumont et al.
D383466 September 9, 1997 Burrell et al.
D413605 September 7, 1999 Thomas
D470848 February 25, 2003 Morooka
Other references
  • Website printout: www.linksys.com, 1 sheet Aug. 1, 2002.
  • Website printout: www.smc.com, 9 sheets Aug. 1, 2002.
  • Website printout: www.netgear.com, 4 sheets Aug. 1, 2002.
  • Website printout: www.dlink.com, 2 sheets Aug. 1, 2002.
Patent History
Patent number: D490402
Type: Grant
Filed: Oct 2, 2002
Date of Patent: May 25, 2004
Assignee: D-Link Systems, Inc. (Irvine, CA)
Inventors: Richard K. Jung (Laguna Niguel, CA), Joie L. Puckett (Long Beach, CA)
Primary Examiner: Charles A. Rademaker
Attorney, Agent or Law Firms: Law Office of Duncan Palmatier, Duncan Palmatier
Application Number: 29/168,559
Classifications
Current U.S. Class: Telephone Equipment (D14/240)
International Classification: 1403;