Headset assembly
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Description
FIG. 1 is a front perspective view of a headset assembly of the present invention;
FIG. 2 is a bottom view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a first side view thereof;
FIG. 5 is a second side view thereof;
FIG. 6 is a front view thereof; and,
FIG. 7 is a back view thereof.
Claims
The ornamental design for a headset assembly, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D358390 | May 16, 1995 | Hayashi |
D394436 | May 19, 1998 | Hall et al. |
D425888 | May 30, 2000 | Fitzgerald |
D429229 | August 8, 2000 | Fitzgerald |
D449290 | October 16, 2001 | Taylor et al. |
D456379 | April 30, 2002 | Fitzgerald |
D1062429 | February 2000 | JP |
D1125517 | November 2001 | JP |
D1151310 | August 2002 | JP |
D1152541 | September 2002 | JP |
Patent History
Patent number: D491917
Type: Grant
Filed: Jun 27, 2003
Date of Patent: Jun 22, 2004
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka)
Inventor: Yoshihiko Asai (Tokyo)
Primary Examiner: Paula A. Greene
Attorney, Agent or Law Firm: Brinks Hofer Gilson & Lione
Application Number: 29/185,448
Type: Grant
Filed: Jun 27, 2003
Date of Patent: Jun 22, 2004
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka)
Inventor: Yoshihiko Asai (Tokyo)
Primary Examiner: Paula A. Greene
Attorney, Agent or Law Firm: Brinks Hofer Gilson & Lione
Application Number: 29/185,448
Classifications