Headset assembly

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Description

FIG. 1 is a front perspective view of a headset assembly of the present invention;

FIG. 2 is a bottom view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a first side view thereof;

FIG. 5 is a second side view thereof;

FIG. 6 is a front view thereof; and,

FIG. 7 is a back view thereof.

Claims

The ornamental design for a headset assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
D358390 May 16, 1995 Hayashi
D394436 May 19, 1998 Hall et al.
D425888 May 30, 2000 Fitzgerald
D429229 August 8, 2000 Fitzgerald
D449290 October 16, 2001 Taylor et al.
D456379 April 30, 2002 Fitzgerald
Foreign Patent Documents
D1062429 February 2000 JP
D1125517 November 2001 JP
D1151310 August 2002 JP
D1152541 September 2002 JP
Patent History
Patent number: D491917
Type: Grant
Filed: Jun 27, 2003
Date of Patent: Jun 22, 2004
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka)
Inventor: Yoshihiko Asai (Tokyo)
Primary Examiner: Paula A. Greene
Attorney, Agent or Law Firm: Brinks Hofer Gilson & Lione
Application Number: 29/185,448
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)
International Classification: 1401;