Electronic component cooling apparatus

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Description

FIG. 1 is a front view of an electronic component cooling apparatus according to our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a cross-sectional view along line 8—8 of FIG. 5.

Claims

The ornamental design for a electronic component cooling apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
6449151 September 10, 2002 Chen
6449152 September 10, 2002 Lin
6466443 October 15, 2002 Chen
6507491 January 14, 2003 Chen
6525941 February 25, 2003 Lai
6560111 May 6, 2003 Lo
D478876 August 26, 2003 Tan et al.
Patent History
Patent number: D501450
Type: Grant
Filed: Jun 10, 2003
Date of Patent: Feb 1, 2005
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Michinori Watanabe (Nagano), Toshiki Ogawara (Nagano), Masayuki Iijima (Nagano), Haruhisa Maruyama (Nagano)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney: Rankin, Hill, Porter & Clark LLP
Application Number: 29/183,270
Classifications
Current U.S. Class: Heat Sink (D13/179)