Electronic component cooling apparatus
Description
FIG. 1 is a front view of an electronic component cooling apparatus according to our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a right side view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is a cross-sectional view along line 8—8 of FIG. 5.
Claims
The ornamental design for a electronic component cooling apparatus, as shown and described.
Referenced Cited
Patent History
Patent number: D501450
Type: Grant
Filed: Jun 10, 2003
Date of Patent: Feb 1, 2005
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Michinori Watanabe (Nagano), Toshiki Ogawara (Nagano), Masayuki Iijima (Nagano), Haruhisa Maruyama (Nagano)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney: Rankin, Hill, Porter & Clark LLP
Application Number: 29/183,270
Type: Grant
Filed: Jun 10, 2003
Date of Patent: Feb 1, 2005
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Michinori Watanabe (Nagano), Toshiki Ogawara (Nagano), Masayuki Iijima (Nagano), Haruhisa Maruyama (Nagano)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney: Rankin, Hill, Porter & Clark LLP
Application Number: 29/183,270
Classifications
Current U.S. Class:
Heat Sink (D13/179)