Package for computer cable
Description
FIG. 1 is a perspective view disclosing an embodiment of a blister package for a computer cable incorporating my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 if a right side elevational view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a top plan view of an alternate embodiment of my design as illustrated in FIGS. 1-6.
The broken line showing in the views is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a package for computer cable, as shown and described.
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Patent History
Patent number: D513976
Type: Grant
Filed: Aug 28, 2003
Date of Patent: Jan 31, 2006
Inventor: Henry Milan (Rochester Hills, MI)
Primary Examiner: Stella Reid
Assistant Examiner: Mark A. Goodwin
Attorney: Butzel Long
Application Number: 29/189,066
Type: Grant
Filed: Aug 28, 2003
Date of Patent: Jan 31, 2006
Inventor: Henry Milan (Rochester Hills, MI)
Primary Examiner: Stella Reid
Assistant Examiner: Mark A. Goodwin
Attorney: Butzel Long
Application Number: 29/189,066
Classifications
Current U.S. Class:
D9/415;
D9/418