Ink pad assembly
Latest Yi Yao Co., Ltd. Patents:
Description
FIG. 1 is a top perspective view of an ink pad assembly showing my new design;
FIG. 2 is a top plan view thereof drawn on a slightly reduced scale;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a side elevation thereof; and,
FIG. 5 is another top perspective view thereof shown in a open condition.
Claims
The ornamental design for an ink pad assembly, as shown and described.
Referenced Cited
U.S. Patent Documents
D115959 | August 1939 | Gaige |
D223056 | March 1972 | Majewski |
D228157 | August 1973 | Sussman |
4375191 | March 1, 1983 | Dickey |
5505130 | April 9, 1996 | Winston |
D372341 | July 30, 1996 | Arntsen |
D381038 | July 15, 1997 | Yasoshima |
D389509 | January 20, 1998 | Yasoshima |
D427624 | July 4, 2000 | Yasohima |
D482497 | November 18, 2003 | Mansau et al. |
Patent History
Patent number: D515620
Type: Grant
Filed: Mar 28, 2005
Date of Patent: Feb 21, 2006
Assignee: Yi Yao Co., Ltd. (Keelung)
Inventor: Yun Dien Lien (Keelung)
Primary Examiner: Charles A. Rademaker
Attorney: Bacon & Thomas PLLC
Application Number: 29/226,239
Type: Grant
Filed: Mar 28, 2005
Date of Patent: Feb 21, 2006
Assignee: Yi Yao Co., Ltd. (Keelung)
Inventor: Yun Dien Lien (Keelung)
Primary Examiner: Charles A. Rademaker
Attorney: Bacon & Thomas PLLC
Application Number: 29/226,239
Classifications
Current U.S. Class:
Stamp Pad (D18/17)