Heating tube for semiconductor-making furnace
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FIG. 1 is a front elevational view of a first embodiment of a heating tube for semiconductor-making furnace showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left-side elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a sectional view on line 7—7 in FIG. 3;
FIG. 8 is a front elevational view of a second embodiment of the heating tube for semiconductor-making furance;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is a left-side elevational view thereof;
FIG. 11 is a right-side elevational view thereof;
FIG. 12 is a top plan view thereof;
FIG. 13 is a bottom plan view thereof; and,
FIG. 14 is a sectional view on line 14—14 in FIG. 10.
The broken lines are for illustrative purposes only and form no part of the claimed design.
Claims
I claim the ornamental design for heating tube for semiconductor-making furnace, as shown and described.
Type: Grant
Filed: May 22, 2003
Date of Patent: Apr 11, 2006
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Tomoki Haneishi (Esashi)
Primary Examiner: Robert M. Spear
Assistant Examiner: Susan Bennett Hattan
Attorney: Ladas and Parry LLP
Application Number: 29/182,226