Headset body for communications headset
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FIG. 1 is a lower front right perspective view of a headset body for communications headset, the broken line drawings of an illustrative microphone boom and a receiver are for illustrative purposes only and form no part of the claimed design.
FIG. 2 is a left side elevational view of the headset body.
FIG. 3 is a right side elevational view of the headset body.
FIG. 4 is a rear elevational view of the headset body.
FIG. 5 is a front elevational view of the headset body.
FIG. 6 is a bottom plan view of the headset body; and,
FIG. 7 is a top plan view of the headset body.
The broken lines are for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a headset body for communications headset, as shown and described.
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Type: Grant
Filed: Mar 17, 2004
Date of Patent: Apr 18, 2006
Assignee: Plantronics, Inc. (Santa Cruz, CA)
Inventors: Fred Polito (Santa Cruz, CA), Soohyun Ham (Santa Cruz, CA), Jay Wilson (Portola Valley, CA), Andy K. Richardson (Aptos, CA), Cliff M. Gyotoku (San Jose, CA)
Primary Examiner: Paula A. Greene
Attorney: Peter Hsieh
Application Number: 29/201,594
