Headset body for a communications headset

- Plantronics, Inc.
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Description

FIG. 1 is a lower front left perspective view of a headset body for a communications headset, the broken line drawing of an illustrative earloop is for illustrative purposes only and form no part of the claimed design.

FIG. 2 is a lower front right perspective view of the headset body.

FIG. 3 is a bottom plan view of the headset body.

FIG. 4 is a top plan view of the headset body.

FIG. 5 is a front elevational view of the headset body.

FIG. 6 is a rear elevational view of the headset body.

FIG. 7 is a right side elevational view of the headset body; and,

FIG. 8 is a left side elevational view of the headset body.

Claims

The ornamental design for a headset body for a communications headset, as shown and described.

Referenced Cited
U.S. Patent Documents
D463791 October 1, 2002 Nagai et al.
D471889 March 18, 2003 Rath et al.
D471898 March 18, 2003 Bae
D487078 February 24, 2004 Chen
D494569 August 17, 2004 Ma
D494570 August 17, 2004 Ma
D498750 November 23, 2004 Ma
D502171 February 22, 2005 Tang et al.
D504884 May 10, 2005 Hering
Patent History
Patent number: D520497
Type: Grant
Filed: Mar 9, 2005
Date of Patent: May 9, 2006
Assignee: Plantronics, Inc. (Santa Cruz, CA)
Inventor: Joseph W. Yang (San Jose, CA)
Primary Examiner: Paula A. Greene
Attorney: Peter Hsieh
Application Number: 29/225,022
Classifications
Current U.S. Class: Headphone (D14/223)