High density multimedia interface connector

- Advanced Connectek, Inc.
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Description

FIG. 1 is a front and a lower right perspective view of a high density multimedia interface connector showing our new design;

FIG. 2 is a top view of the high density multimedia interface connector shown in FIG. 1;

FIG. 3 is a bottom view of the high density multimedia interface connector shown in FIG. 1;

FIG. 4 is a front view of the high density multimedia interface connector shown in FIG. 1;

FIG. 5 is a rear view of the high density multimedia interface connector shown in FIG. 1;

FIG. 6 is a left side view of the high density multimedia interface connector shown in FIG. 1; and,

FIG. 7 is a right side view of the high density multimedia interface connector shown in FIG. 1.

Claims

The ornamental design for a high density multimedia interface connector, as shown and described.

Referenced Cited
U.S. Patent Documents
6238241 May 29, 2001 Zhu et al.
D450302 November 13, 2001 Shimojyo
D451477 December 4, 2001 Shimojyo
D452480 December 25, 2001 Shimojyo
D452481 December 25, 2001 Shimojyo
D452847 January 8, 2002 Shimojyo
D452848 January 8, 2002 Shimojyo
6659799 December 9, 2003 Yang
Patent History
Patent number: D526619
Type: Grant
Filed: Jan 28, 2004
Date of Patent: Aug 15, 2006
Assignee: Advanced Connectek, Inc. (Taipei)
Inventor: Wen-Hsien Tsai (Taipei Hsien)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Selina Sikder
Attorney: Johnson & Associates, PC
Application Number: 29/198,207