High density multimedia interface connector
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FIG. 1 is a front and a lower right perspective view of a high density multimedia interface connector showing our new design;
FIG. 2 is a top view of the high density multimedia interface connector shown in FIG. 1;
FIG. 3 is a bottom view of the high density multimedia interface connector shown in FIG. 1;
FIG. 4 is a front view of the high density multimedia interface connector shown in FIG. 1;
FIG. 5 is a rear view of the high density multimedia interface connector shown in FIG. 1;
FIG. 6 is a left side view of the high density multimedia interface connector shown in FIG. 1; and,
FIG. 7 is a right side view of the high density multimedia interface connector shown in FIG. 1.
Claims
The ornamental design for a high density multimedia interface connector, as shown and described.
Type: Grant
Filed: Jan 28, 2004
Date of Patent: Aug 15, 2006
Assignee: Advanced Connectek, Inc. (Taipei)
Inventor: Wen-Hsien Tsai (Taipei Hsien)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Selina Sikder
Attorney: Johnson & Associates, PC
Application Number: 29/198,207