Heat sink

- Sanyo Denki Co., Ltd.
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Description

This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.

FIG. 1 is a front side elevation view of the heat sink;

FIG. 2 is a rear side elevation view;

FIG. 3 is a right side elevation view;

FIG. 4 is a left side elevation view;

FIG. 5 is a top plan view;

FIG. 6 is a bottom plan view;

FIG. 7 is a perspective view as viewed from the front;

FIG. 8 is a perspective view as viewed from the rear;

FIG. 9 is a cross sectional view as taken along line 9—9 of FIG. 1; and,

FIG. 10 is a cross sectional view as taken along line 10—10 of FIG. 5.

This article is formed with a plurality of metallic fins which are integrally provided on a metallic base.

Claims

The ornamental design for a heat sink, as shown and described.

Referenced Cited
U.S. Patent Documents
5945736 August 31, 1999 Rife et al.
6446708 September 10, 2002 Lai
6452803 September 17, 2002 Liu
D476958 July 8, 2003 Tsai
D481688 November 4, 2003 Lee et al.
6832410 December 21, 2004 Hegde
6883593 April 26, 2005 Johnson et al.
6913072 July 5, 2005 Luo
7025125 April 11, 2006 Sheng et al.
20020195229 December 26, 2002 Hsieh et al.
20050247437 November 10, 2005 Ying et al.
Foreign Patent Documents
480136 March 1991 TW
480137 March 1991 TW
514487 December 1991 TW
514488 December 1991 TW
Patent History
Patent number: D529450
Type: Grant
Filed: Nov 8, 2005
Date of Patent: Oct 3, 2006
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Masashi Miyazawa (Nagano), Tomoaki Ikeda (Nagano), Toshiki Ogawara (Nagano)
Primary Examiner: Selina Sikder
Attorney: Rankin, Hill, Porter & Clark LLP
Application Number: 29/242,246
Classifications
Current U.S. Class: Heat Sink (D13/179)