Heat sink
Latest Sanyo Denki Co., Ltd. Patents:
This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.
FIG. 1 is a front side elevation view of the heat sink;
FIG. 2 is a rear side elevation view;
FIG. 3 is a right side elevation view;
FIG. 4 is a left side elevation view;
FIG. 5 is a top plan view;
FIG. 6 is a bottom plan view;
FIG. 7 is a perspective view as viewed from the front;
FIG. 8 is a perspective view as viewed from the rear;
FIG. 9 is a cross sectional view as taken along line 9—9 of FIG. 1; and,
FIG. 10 is a cross sectional view as taken along line 10—10 of FIG. 5.
This article is formed with a plurality of metallic fins which are integrally provided on a metallic base.
Claims
The ornamental design for a heat sink, as shown and described.
5945736 | August 31, 1999 | Rife et al. |
6446708 | September 10, 2002 | Lai |
6452803 | September 17, 2002 | Liu |
D476958 | July 8, 2003 | Tsai |
D481688 | November 4, 2003 | Lee et al. |
6832410 | December 21, 2004 | Hegde |
6883593 | April 26, 2005 | Johnson et al. |
6913072 | July 5, 2005 | Luo |
7025125 | April 11, 2006 | Sheng et al. |
20020195229 | December 26, 2002 | Hsieh et al. |
20050247437 | November 10, 2005 | Ying et al. |
480136 | March 1991 | TW |
480137 | March 1991 | TW |
514487 | December 1991 | TW |
514488 | December 1991 | TW |
Type: Grant
Filed: Nov 8, 2005
Date of Patent: Oct 3, 2006
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Masashi Miyazawa (Nagano), Tomoaki Ikeda (Nagano), Toshiki Ogawara (Nagano)
Primary Examiner: Selina Sikder
Attorney: Rankin, Hill, Porter & Clark LLP
Application Number: 29/242,246