Microcontroller enclosure housing
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Description
Claims
The ornamental design for a microcontroller enclosure housing, as shown and described.
Referenced Cited
U.S. Patent Documents
D327880 | July 14, 1992 | Lou |
D330704 | November 3, 1992 | Wagner |
D331395 | December 1, 1992 | Lou |
D332938 | February 2, 1993 | Lambert et al. |
D339116 | September 7, 1993 | Gates et al. |
D367039 | February 13, 1996 | Loh |
D477814 | July 29, 2003 | Droulin et al. |
D494544 | August 17, 2004 | Dulai et al. |
D526614 | August 15, 2006 | Kajiura |
Patent History
Patent number: D553571
Type: Grant
Filed: Feb 25, 2004
Date of Patent: Oct 23, 2007
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel Bui
Application Number: 29/200,217
Type: Grant
Filed: Feb 25, 2004
Date of Patent: Oct 23, 2007
Assignee: Sauer-Danfoss Inc. (Ames, IA)
Inventors: Joel R. Carpenter (Zimmerman, MN), Cezary Pluska (Kiel)
Primary Examiner: Daniel Bui
Application Number: 29/200,217
Classifications