Insulation dispacement connection terminal assembly

- Surtec Industries Inc.
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Description

FIG. 1 is a perspective view of an insulation dispacement connection terminal assembly showing my new design;

FIG. 2 is front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for an insulation dispacement connection terminal assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
3530426 September 1970 Snyder, Jr.
D229940 January 1974 Irie
4553801 November 19, 1985 Zajeski
5921788 July 13, 1999 Wilson et al.
6042423 March 28, 2000 Murr et al.
6283795 September 4, 2001 Chen
6371802 April 16, 2002 Smalley et al.
D474153 May 6, 2003 Smalley et al.
Patent History
Patent number: D564969
Type: Grant
Filed: Jan 11, 2006
Date of Patent: Mar 25, 2008
Assignee: Surtec Industries Inc. (Keelung)
Inventor: Michael Chen (Keelung)
Primary Examiner: Daniel Bui
Attorney: Rabin & Berdo, P.C.
Application Number: 29/251,600