Insulation dispacement connection terminal assembly
Latest Surtec Industries Inc. Patents:
Description
Claims
The ornamental design for an insulation dispacement connection terminal assembly, as shown and described.
Referenced Cited
Patent History
Patent number: D564969
Type: Grant
Filed: Jan 11, 2006
Date of Patent: Mar 25, 2008
Assignee: Surtec Industries Inc. (Keelung)
Inventor: Michael Chen (Keelung)
Primary Examiner: Daniel Bui
Attorney: Rabin & Berdo, P.C.
Application Number: 29/251,600
Type: Grant
Filed: Jan 11, 2006
Date of Patent: Mar 25, 2008
Assignee: Surtec Industries Inc. (Keelung)
Inventor: Michael Chen (Keelung)
Primary Examiner: Daniel Bui
Attorney: Rabin & Berdo, P.C.
Application Number: 29/251,600
Classifications