Heat dissipating assembly

- AMA Precision, Inc.
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Description

FIG. 1 is a perspective view of a heat dissipating assembly showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof, the left side being a mirror image;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipating assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
D481452 October 28, 2003 Luo
D491260 June 8, 2004 Luo
D509580 September 13, 2005 Lin
7025125 April 11, 2006 Sheng et al.
7130192 October 31, 2006 Wang et al.
7218518 May 15, 2007 Chin et al.
Patent History
Patent number: D566828
Type: Grant
Filed: Oct 27, 2006
Date of Patent: Apr 15, 2008
Assignee: AMA Precision, Inc. (Zhongzheng District, Taipei)
Inventors: Guo-Shiung Tzeng (Taipei), Ching-Yu Hsu (Taipei), Pei-Ching Hung (Taipei)
Primary Examiner: Lisa Lichtenstein
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/268,019
Classifications
Current U.S. Class: Fan Element (D23/411)