Abstract: A modular heat sink including a first heat sink and a second heat sink is disclosed. The first heat sink includes a first base having a female connecting part and a first fin assembly disposed on the first base. The second heat sink is connected to the first heat sink and includes a second base having a male connecting part for coupling the female connecting part and a second fin assembly disposed on the second base. The male connecting part is coupled with the female connecting part.

Abstract: A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.

Abstract: A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector.

Abstract: A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector.

Abstract: An LED heat dissipation module including a heat pipe, an LED and a heat sink is provided. The heat pipe has at least a flat portion having a surface. The LED is provided at the surface of the flat portion of the heat pipe. The heat sink is coupled to the heat pipe. The heat dissipation efficiency of the LED heat dissipation module is increased.

Abstract: A clip module and heat-dissipation device having the same is disclosed. The heat-dissipation device includes a retention module (RM) disposed on a circuit board having a heat-source, a heat sink disposed on the heat-source, and a clip module. The clip module is across in the heat sink and is clipped with the RM. The clip module includes a body, a fastener, and a pressing structure. One end of the body is clipped with the RM, and the heat sink is pressed on the heat-source by the body. The fastener is disposed in the other end of the body. One end of the fastener is clip with the RM, and a guiding portion is disposed in the other end of the fastener. The guiding portion is slid in a guiding groove of the pressing structure, so that the pressing structure is connected with the fastener.

Abstract: A light emitting diode (LED) base with radiating fins is disclosed. The LED base includes a base plate which having a riveting structure on its bottom side, a conducting circuit, an LED unit, and radiating fins which are directly riveted to stand at the riveting structure on the bottom side of the base plate. The base plate and the riveted radiating fins are directly used as the heat dissipation module of the LED base to reduce the thermal resistance of the LED base during the heat dissipation process.

Abstract: A light emitting diode (LED) module is disclosed. The LED module includes a base, a LED component, a pressing piece, and a plurality of screws. The base has a top surface and a positioning hole on the top surface. The LED component has a bottom surface and includes a positioning protrusion on the bottom surface. Wherein after the LED component is disposed on the base, the positioning protrusion is coupled with the positioning hole to position the LED component at the base. A pin of the LED component is located between the pressing piece and the base. The screws are used to screw the pressing member on the base.

Abstract: A light emitting diode (LED) module is disclosed. The LED module includes a base, a LED component, a pressing piece, and a plurality of screws. The base has a top surface and a positioning hole on the top surface. The LED component has a bottom surface and includes a positioning protrusion on the bottom surface. Wherein after the LED component is disposed on the base, the positioning protrusion is coupled with the positioning hole to position the LED component at the base. A pin of the LED component is located between the pressing piece and the base. The screws are used to screw the pressing member on the base.

Abstract: A clip module and a heat dissipation device having the same are disclosed, wherein the heat dissipation device is suitable to dissipate the heat for a heat source on a circuit board. The heat dissipation device includes a retention module, a heat sink and a clip module. The retention module is provided on the circuit board and around the heat source, and the heat sink is provided on the heat source. The clip module includes a body, a fastener fastened to the retention module and a pressing structure. The pressing structure includes a first triangle block and a second triangle block which is slidably provided on two adjacent surfaces of the first triangle block, and the fastener is pivotally provided at the second triangle block.

Abstract: A method for treating the surface of the heat dissipation module is provided. The method includes the following steps. First, a heat dissipation module is provided. Next, a nano-material layer is formed on the surface of the heat dissipation module. Thus, the surface of the heat dissipation module is isolated from air and effectively prevented from being oxidized or polluted.

Abstract: A heat dissipation module is disclosed. The heat dissipation module suitable to dissipates heat generating by for a heat source, and multiple fixing parts are disposed around the heat source. The heat dissipation module includes a heat sink, two first rods, and two second rods corresponding to the first rods. The first rods and the second rods are pivotally provided on the heat sink. Each first shaft rod is suitable to rotate about a first axis. Two hooks of each first rod fasten the fixing parts easily. Each second rod is suitable to rotate about a second axis and leans against the heat sink. Thus, each second rod tightly fits with each first rod, and two hooks of each first rod tightly fasten the fixing parts. The heat sink is forced by the first rods, and the heat sink and the heat source abut against each other tightly.

Abstract: An illumination device having an optical element fixing structure is disclosed. The illumination device includes a plurality of light emitting diodes, a plurality of lenses and a supporter. The lenses are provided on the optical paths of the light emitting diodes, and each of the lenses has a guiding part. The supporter has a plurality of holding rooms. One side of the holding room has an embedded portion. The guiding part may be guided to the embedded portion to allow the body of the lens to be provided in the holding room.

Abstract: A light emitting diode (LED) light source device includes a plurality of LED modules, a base and a clip. The base has a first base body, a second base body, and a third base body. The second base body and the third base body extend from two sides of the first base body and are corresponding to each other. The LED modules are provided at inside surfaces of the first base body, the second base body and the third base body. The clip holds the LED modules and fastens the second base body and the third base body to enable the LED modules to be tightly assembled at the base.

Abstract: An LED lighting device is disclosed. The LED lighting device includes a lampshade, a circuit board, edge lighting light emitting diodes (LEDs), and an optical film set. The lampshade has a bottom and a side wall connected to the periphery of the bottom. The other end of the side wall opposite to the bottom defines a light outlet section. The circuit board is provided at the lampshade. The edge lighting LEDs are disposed on the bottom of the lampshade and are electrically connected to the circuit board. Light emitted from each of the edge lighting LEDs is reflected by the lampshade and then exits the lighting device through the light outlet section. The optical film set is disposed at the light outlet section of the lampshade.

Abstract: A light emitting module includes a heat dissipation base, a circuit board and a light emitting diode (LED) package. The supporting surface of the heat dissipation base has a positioning structure. The circuit board is disposed on the supporting surface of the heat dissipation base, and it has an opening for exposing the positioning structure. The LED package is positioned at the positioning structure through the opening and is electrically connected to the circuit board.

Abstract: A light emitting diode (LED) heat dissipation module is suitable to dissipate heat for at least a LED. The LED heat dissipation module includes a heat dissipation base, at least a heat conductor, and a plurality of heat dissipation fins. The heat dissipation base has a first surface and a second surface corresponding to the first surface. The LED is provided on the first surface and the heat conductor is provided on the second surface. In addition, the heat dissipation fins are provided at the heat conductor, and the heat dissipation fins are separated from the heat dissipation base.

Abstract: An LED display includes a fixing frame and a plurality of LED modules. The fixing frame has at least one rotating shaft. The LED modules are correspondingly pivoted on the rotating shaft, and each of the LED modules is adapted to rotate around the corresponding rotating shaft. The LED modules can be easily disassembled from the fixing frame for repair.

Abstract: A modular heat sink including a first heat sink and a second heat sink is disclosed. The first heat sink includes a first base having a female connecting part and a first fin assembly disposed on the first base. The second heat sink is connected to the first heat sink and includes a second base having a male connecting part for coupling the female connecting part and a second fin assembly disposed on the second base. The male connecting part is coupled with the female connecting part.