Abstract: A modular heat sink including a first heat sink and a second heat sink is disclosed. The first heat sink includes a first base having a female connecting part and a first fin assembly disposed on the first base. The second heat sink is connected to the first heat sink and includes a second base having a male connecting part for coupling the female connecting part and a second fin assembly disposed on the second base. The male connecting part is coupled with the female connecting part.

Abstract: A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.

Abstract: A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector.

Abstract: An LED heat dissipation module including a heat pipe, an LED and a heat sink is provided. The heat pipe has at least a flat portion having a surface. The LED is provided at the surface of the flat portion of the heat pipe. The heat sink is coupled to the heat pipe. The heat dissipation efficiency of the LED heat dissipation module is increased.

Abstract: A clip module and heat-dissipation device having the same is disclosed. The heat-dissipation device includes a retention module (RM) disposed on a circuit board having a heat-source, a heat sink disposed on the heat-source, and a clip module. The clip module is across in the heat sink and is clipped with the RM. The clip module includes a body, a fastener, and a pressing structure. One end of the body is clipped with the RM, and the heat sink is pressed on the heat-source by the body. The fastener is disposed in the other end of the body. One end of the fastener is clip with the RM, and a guiding portion is disposed in the other end of the fastener. The guiding portion is slid in a guiding groove of the pressing structure, so that the pressing structure is connected with the fastener.

Abstract: A light emitting diode (LED) base with radiating fins is disclosed. The LED base includes a base plate which having a riveting structure on its bottom side, a conducting circuit, an LED unit, and radiating fins which are directly riveted to stand at the riveting structure on the bottom side of the base plate. The base plate and the riveted radiating fins are directly used as the heat dissipation module of the LED base to reduce the thermal resistance of the LED base during the heat dissipation process.

Abstract: An LED table lamp including a base, a holder, and a light emitting device is provided. An end of the holder is connected to the base, and the light emitting device includes a lampshade pivotally connected to another end of the holder, a reflecting thin film and an LED light module. The lampshade has at least a side-wall and a top-wall connected the side-wall. The reflecting thin film is disposed on the top-wall and the LED light module is disposed in the side-wall. The light emitted from the LED light module is reflected several times by the reflecting thin film to render the brightness of the light emitted out of the lampshade substantially uniform.

Abstract: A clip module for fixing a heat dissipation element on a base is disclosed. The clip module includes a body, two pressing elements, a fastener and two linkage elements. The body has a pressing part and a pivot part. The pivot part is located at one end of the body. Each pressing element has a first linkage point, and one end of the pressing elements is coupled to the pivot part. The fastener is suitable to be fastened to the base, and has two second linkage points. The linkage elements connect the first linkage points and the second linkage points. The pressing elements rotate around the pivot part to drive the linkage elements to respectively rotate around the corresponding second linkage points so that the fastener is fastened to the base, and the pressing part presses against the heat dissipation element.

Abstract: An active noise elimination electronic system is disclosed. The electronic system includes a housing, a first electronic device, a noise receiver, an error sensor, a sound actuator, and a microprocessor. The first electronic device is arranged in the housing. The noise receiver is arranged in the housing and is close to the first electronic device for collecting first noise generated by the first electronic device. The error sensor is arranged in the housing for collecting a feedback noise which is different from the first noise. The microprocessor is coupled to the noise receiver, the error sensor and the sound actuator, and controls the sound actuator to produce a second noise which phase is inverse the first noise according to the first noise and the feedback noise.

Abstract: A thermal module with heat pipe is disclosed to include a heat-dissipation plate, which has an accommodation groove that accommodates a heat pipe that is bonded to the accommodation groove with a bonding glue, and at least one retaining groove formed in the accommodation groove for retaining the bonding glue to prevent overflow of the bonding glue during its fluid state so as to improve the yield rate of the fabrication of the thermal module with heat pipe, avoid a further follow-up process, facilitate the quality control, save the cost, and keep a good looking of the finished product.

Abstract: A direction-adjustable diffusive device is disclosed to include a heat sink, which has a rotating mechanism positioned on the outside of the heat sink, and a cowling, which has another rotating mechanism correspondingly coupled to the rotating mechanism of the heat sink, and a wind-guiding channel comprising a first wind-guiding hole facing the heat sink. The cowling uses the other rotating mechanism and the rotating mechanism for allowing the cowling to be turned about the heat sink to adjust a heat dissipation direction of the heat sink. Therefore, the cowling can use the other rotating mechanism and the rotating mechanism to rotate relatively to the heat sink, which means that the direction of the cowling can be adjusted through 360° according to the requirements to dissipate heat through the heat sink.

Abstract: A fastener requiring less space for the performance of the locking or unlocking action without causing an interference with other surrounding component parts is disclosed to include a locating bar, a first hook member connected to one end of the locating bar, a slide slidably coupled to the locating bar and having a relatively lower portion and a relatively higher portion, a second hook member inserted through the locating bar and the slide in a first direction, and a transverse pin inserted through the second hook member in a second direction and supported on the slide to control locking/unlocking action of the fastener.