Lead frame for a through-hole light emitting diode device

- Semi-Photonics Co., Ltd.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of the lead frame for a through-hole light emitting diode device showing our new design.

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevation view thereof; and,

FIG. 7 is a right side elevation view thereof.

The broken lines represent unclaimed subject matter.

Claims

The ornamental design for a lead frame for a through-hole light emitting diode device, as shown and described.

Referenced Cited
U.S. Patent Documents
5977626 November 2, 1999 Wang et al.
6559379 May 6, 2003 Solanki et al.
6569764 May 27, 2003 Hirashima et al.
6891256 May 10, 2005 Joshi et al.
6919625 July 19, 2005 O'Shea et al.
6943433 September 13, 2005 Kamada
6999318 February 14, 2006 Newby
D520965 May 16, 2006 Omata
D532383 November 21, 2006 Nagai et al.
D536309 February 6, 2007 Muguruma et al.
7211882 May 1, 2007 Wang et al.
7321161 January 22, 2008 Teixeira et al.
20030116769 June 26, 2003 Song et al.
20050127483 June 16, 2005 Joshi et al.
20050269587 December 8, 2005 Loh et al.
20060157726 July 20, 2006 Loh et al.
Patent History
Patent number: D582360
Type: Grant
Filed: Oct 12, 2006
Date of Patent: Dec 9, 2008
Assignee: Semi-Photonics Co., Ltd. (Chu-nan)
Inventors: Jui-Kang Yen (Taipei), Yung-Wei Chen (Taichung)
Primary Examiner: Selina Sikder
Attorney: Patterson & Sheridan, LLP
Application Number: 29/249,578
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)