Abstract: A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.
Abstract: Light emitting diode (LED) devices, components and systems are provided. LED devices include a submount with a plurality of LEDs disposed thereon. The LEDs mounted on a submount can be spaced apart at predetermined dimensions to control the gaps between each of the plurality of LEDs. By controlling the gaps between LEDs the optical output from the LED device can be optimized, including improving emission and/or color uniformity, minimizing or eliminating deadspots in the light emission, and/or minimizing or eliminating an optical cross. A phosphor layer can be disposed on the plurality of LEDs and between the LEDs in the gaps therebetween.
September 13, 2016
Date of Patent:
October 1, 2019
Troy Gould, Colin Kelly Blakely, Kyle Damborsky, Jesse Colin Reiherzer
Abstract: An LED package structure with multiple color temperatures includes a substrate, a circuit layer disposed on the substrate, a plurality of first LED chips and a plurality of second LED chips disposed on the circuit layer, and a light conversion layer disposed on the substrate and the circuit layer. The light conversion layer has a spiral surface arranged away from the substrate. The light conversion layer includes a first light conversion portion and a second light conversion portion arranged around a lateral side of the first light conversion portion. The color temperature of the first light conversion portion is different from that of the second light conversion portion. The first LED chips are embedded in the first light conversion portion, and the second LED chips are embedded in the second light conversion portion. Thus, the LED package structure provided by the instant disclosure has good production efficiency.
Abstract: A light emitting diode includes a substrate that has an elongated rectangular shape in one direction; a light emitting structure positioned on the substrate and having an opening for exposing a first conductive semiconductor layer; a first electrode pad disposed to be closer to a first corner of the substrate; a second electrode pad disposed to be relatively closer to a second corner of the substrate opposing to the first corner; a first extension extending from the first electrode pad; and a second extension and a third extension extending from the second electrode pad to sides of the first extension, wherein an imaginary line connecting an end of the second extension and an end of the third extension is located between the first electrode pad and the first corner.
February 26, 2018
Date of Patent:
January 29, 2019
SEOUL VIOSYS CO., LTD.
Mae Yi Kim, Jin Woong Lee, Yeo Jin Yoon, Seom Geun Lee, Yong Woo Ryu, Keum Ju Lee