Logic module

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Description

FIG. 1 is a topview of the logic module; and,

FIG. 2 is a side view of the logic module.

Claims

I claim the ornamental design for a logic module, as shown and described.

Referenced Cited
U.S. Patent Documents
D290694 July 7, 1987 Shimizu et al.
D307576 May 1, 1990 Abe et al.
D358753 May 30, 1995 Yoshida et al.
D368252 March 26, 1996 Nakai
D400180 October 27, 1998 Shimizu
Patent History
Patent number: D602445
Type: Grant
Filed: Mar 6, 2008
Date of Patent: Oct 20, 2009
Assignee: Siemens Aktiengesellschaft (Munich)
Inventor: Ai Cheng Liu (Nanjing)
Primary Examiner: Daniel D Bui
Assistant Examiner: Thomas J Johannes
Application Number: 29/301,544
Classifications