LED package
Latest Everlight Electronic Co., Ltd. Patents:
Description
Claims
The ornamental design for the led package, as shown and as described.
Referenced Cited
U.S. Patent Documents
D500294 | December 28, 2004 | Ishida |
D512693 | December 13, 2005 | Kim et al. |
7242035 | July 10, 2007 | Kim et al. |
D576114 | September 2, 2008 | Choi et al. |
D598872 | August 25, 2009 | In et al. |
20020149314 | October 17, 2002 | Takahashi et al. |
20060023451 | February 2, 2006 | Han et al. |
Patent History
Patent number: D609654
Type: Grant
Filed: Apr 7, 2009
Date of Patent: Feb 9, 2010
Assignee: Everlight Electronic Co., Ltd. (Taipei)
Inventor: Chung Chuan Hsieh (Taipei)
Primary Examiner: Selina Sikder
Attorney: Moore & Van Allen PLLC
Application Number: 29/335,029
Type: Grant
Filed: Apr 7, 2009
Date of Patent: Feb 9, 2010
Assignee: Everlight Electronic Co., Ltd. (Taipei)
Inventor: Chung Chuan Hsieh (Taipei)
Primary Examiner: Selina Sikder
Attorney: Moore & Van Allen PLLC
Application Number: 29/335,029
Classifications
Current U.S. Class:
Electron Or Vacuum Tube (23) (D13/180)