Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation device, as shown.

Referenced Cited
U.S. Patent Documents
D286396 October 28, 1986 Luciano
5464054 November 7, 1995 Hinshaw et al.
D376132 December 3, 1996 Orton
D378815 April 15, 1997 Dodson
6196302 March 6, 2001 Chuang
6343014 January 29, 2002 Lin
6648065 November 18, 2003 Huang et al.
6874566 April 5, 2005 Artman et al.
D529873 October 10, 2006 He et al.
7440282 October 21, 2008 Brandenburg et al.
20050078456 April 14, 2005 Mandel et al.
Patent History
Patent number: D616379
Type: Grant
Filed: Sep 29, 2009
Date of Patent: May 25, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: Hsueh-Chen Chang (Miao-Li Hsien), Shan-Ju Lin (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/344,385
Classifications
Current U.S. Class: Heat Sink (D13/179)