Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation device, as shown.

Referenced Cited
U.S. Patent Documents
D286396 October 28, 1986 Luciano
D376132 December 3, 1996 Orton
D378815 April 15, 1997 Dodson
D402025 December 1, 1998 Dodson
6343014 January 29, 2002 Lin
6648065 November 18, 2003 Huang et al.
6874566 April 5, 2005 Artman et al.
D529873 October 10, 2006 He et al.
7325593 February 5, 2008 Kujirai
7440282 October 21, 2008 Brandenburg et al.
Patent History
Patent number: D618632
Type: Grant
Filed: Oct 26, 2009
Date of Patent: Jun 29, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventors: Hsueh-Chen Chang (Miao-Li Hsien), Shan-Ju Lin (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/346,023
Classifications
Current U.S. Class: Heat Sink (D13/179)