Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device showing my new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation device, as shown.

Referenced Cited
U.S. Patent Documents
7396146 July 8, 2008 Wang
D579421 October 28, 2008 Chu
D579422 October 28, 2008 Shuai et al.
20070236935 October 11, 2007 Wang
20080158887 July 3, 2008 Zhu et al.
20080175003 July 24, 2008 Tsou et al.
20090147520 June 11, 2009 Liu et al.
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20090279314 November 12, 2009 Wu et al.
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20100026158 February 4, 2010 Wu
20100027258 February 4, 2010 Maxik et al.
Patent History
Patent number: D618633
Type: Grant
Filed: Oct 26, 2009
Date of Patent: Jun 29, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventor: Shan-Ju Lin (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/346,025
Classifications
Current U.S. Class: Heat Sink (D13/179)