Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device showing my new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation device, as shown.

Referenced Cited
U.S. Patent Documents
D194787 March 1963 Chadwick
3239003 March 1966 Boudette et al.
5661638 August 26, 1997 Mira
5794685 August 18, 1998 Dean
6479895 November 12, 2002 Lee et al.
6525939 February 25, 2003 Liang et al.
6657862 December 2, 2003 Crocker et al.
6712128 March 30, 2004 Dussinger et al.
7193849 March 20, 2007 Xu et al.
D576964 September 16, 2008 Shaner
D608876 January 26, 2010 Huang et al.
Patent History
Patent number: D619549
Type: Grant
Filed: Oct 26, 2009
Date of Patent: Jul 13, 2010
Assignee: Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien)
Inventor: Yu-Pin Liu (Miao-Li Hsien)
Primary Examiner: Selina Sikder
Attorney: Raymond J. Chew
Application Number: 29/346,021
Classifications
Current U.S. Class: Heat Sink (D13/179)